Full Site - : splatter under qfn (Page 14 of 17)

QFN / BGAs with Water-Soluble Fluxes, Bad Practice?

Electronics Forum | Tue Mar 24 17:14:44 EDT 2009 | bas251

In my experience, before my current employment, I have personally seen damage from the water soluable fluxes left under a BGA. In consideration, I have not seen it from an assembly process where the boards are cleaned thoughly, but I have seen it dur

Voids problem in Lead free process

Electronics Forum | Thu Oct 26 10:29:03 EDT 2006 | Mike

First, Voiding under thermal pad is unavoidable(pardon the pun), unless you can find a way to add sufficient amount of solder paste to cover the area, and match that solder volume on your terminal leads. I build HVM qty's of "QFN" components w/ therm

Using isopropanol with DI water for rinsing after washing boards

Electronics Forum | Thu Nov 10 10:45:32 EST 2011 | aqueous

The use of IPA in automated defluxing systems is nearly extinct for the following reasons: 1. IPA is flammable. In a spray-in-air environment, the already low flashpoint is even lower. 2. IPA is not a great solvent. There are specific containme

Anyone facing QFN package crack problem ?

Electronics Forum | Wed Nov 28 16:08:38 EST 2007 | jmelson

I've been using Xilinx TQFP's in the 44 and 144 lead sizes with no trouble. I don't even bake them before reflow and have never had any problem. The Xilinx parts are certainly NOT sensitive, I could not break one with my bare hands if I tried (I ha

Who Makes Good boards?

Electronics Forum | Wed Jul 16 18:46:46 EDT 2008 | mariss

emti, Thank you for the reply but I'm looking for a reasonable quality pcb mfg. We do SMT and thru-hole in house (3 Juki KE-750L machines) of our product. My problem is with the bare boards: holes poorly registered with top copper, solder masks mis

QFN voiding levels

Electronics Forum | Wed Jun 16 07:35:28 EDT 2010 | scottp

Rather than tent the thermal vias, we use a small annular ring of soldermask around them and only print paste in the areas between the vias. Any way you go you're going to have voids under QFNs, so we just try to make it repeatable so our designers

Nordic aQFN73 stencil design

Electronics Forum | Mon Apr 09 12:52:00 EDT 2018 | slthomas

We are about to do a second iteration of something we struggled mightily with last time and I'm hoping to at least make a step in the right direction. There are 12 of these parts on the board and virtually all of them required removal and replacemen

QFN standoff, industry standard

Electronics Forum | Thu Mar 28 13:19:14 EDT 2019 | davef

There is no industry standard for BTC stand-off height. "IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT (BTC) Components" just finished "Final Draft for Industry Review" in December 2018. It mentions stand-off height

QFN/BTC Pad Configuration Commonality for Solder Stencils

Electronics Forum | Mon Apr 29 12:45:00 EDT 2019 | slthomas

When you say "....is there a way to easily (or at all) reference parts with the same specs..." do you mean when ordering stencils, or are you trying to drive your designers to choose a package that you already have in play when they have package opti

MPM Accela vs DEK or other options?

Electronics Forum | Fri Mar 11 13:03:08 EST 2022 | poly

I've just bought the pick and place machines (universal Genesis GX11 and GC30) and oven (RO300fc-c) but I am confused about printers. I've put in an offer for an MPM Accela (2006 or 2008) but I'm not sure if it's a good idea / deal. It's being sold i


splatter under qfn searches for Companies, Equipment, Machines, Suppliers & Information

Selective Soldering Nozzles

High Precision Fluid Dispensers
2024 Eptac IPC Certification Training Schedule

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
2024 Eptac IPC Certification Training Schedule

Training online, at your facility, or at one of our worldwide training centers"