Full Site - : splatter under qfn (Page 5 of 23)

Christopher Associates/Koki Solder to Present Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes at SMTAI 2010

Industry News | 2010-09-29 23:32:58.0

Christopher Associates/Koki Solder announce that Jasbir Bath will present a paper titled “An Investigation into the Development of Tin-Lead and Lead-Free Solder Pastes to Reduce Voiding in Large Contact Area Power Transistor/QFN Type Components” at the upcoming SMTAI Technical Conference, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Christopher Associates Inc.

Multitest's Gemini™ Kelvin Is the Contactor of Choice for QFNs and BGAs

Industry News | 2011-11-27 00:38:42.0

Multitest announces that the usage of its Gemini™ Kelvin is rapidly increasing at two longstanding customers, both of which rank among the top 25 IDMs.

Multitest Elektronische Systeme GmbH

Kester to Host Technical Rework Seminar

Industry News | 2017-02-21 13:54:56.0

Kester is hosting a Technical Rework Seminar, scheduled to take place Tuesday, March 7 at Kester’s Global Headquarters in Itasca, IL.

Kester

PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12

PACE TF 1800 BGA/SMD Rework System for Standard Boards (up to 12" x 12")

New Equipment | Rework & Repair Equipment

Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,

PACE Worldwide

PACE TF 2800 BGA/SMD Rework System for Extra Large Boards

PACE TF 2800 BGA/SMD Rework System for Extra Large Boards

New Equipment | Rework & Repair Equipment

Patented Inductive-Convection Heating Technology Provides Ultimate Thermal Performance Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN,

PACE Worldwide

Finetech to Highlight Precision Rework and BGA Reball systems at SMTAI 2010

Industry News | 2010-10-01 01:05:06.0

Finetech will highlight two rework systems ― the FINEPLACER® core and the Martin Expert 10.6XL ― and the Martin Reball 3.1 unit in booth 406 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Finetech

AMTECH Introduces a New Solder Paste, VS-213, Also Known as the Voidstopper

Industry News | 2014-06-17 21:50:29.0

SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.

AMTECH

Indium Corporation Technology Expert to Present at Assembly, Cleaning, and Reliability Workshop

Industry News | 2014-05-22 11:36:25.0

Indium Corporation's Derrick Herron, technical support engineer, will serve as an expert presenter at ZESTRON’s Assembly, Cleaning, and Reliability Hands-on Workshop on June 10 in Franklin, Mass.

Indium Corporation

Nihon Superior to Highlight SN100C Products at SMTAI 2009

Industry News | 2009-09-17 15:06:04.0

OSAKA, JAPAN — September 2009 — Nihon Superior Co. Ltd., an advanced soldering and brazing supplier to the worldwide market, announces that it will showcase a new, expanded range of SN100C products in booth 624 at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego, CA.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit at Productronica India 2011

Industry News | 2011-09-01 21:35:02.0

Nihon Superior (Singapore) Pte. Ltd., subsidiary of Nihon Superior Co. Ltd. will showcase a new, expanded range of SN100C products in booth 1060 at the upcoming Productronica India 2011 exhibition

Nihon Superior Co., Ltd.


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