Do you repair thick multilayer printed circuit boards that are connected to metal ground planes? Avionics modules that are designed to dissipate heat? Heat-sinking pcb's utilizing lead-free alloys that seem to require a blow-torch to solder effective
In this video we briefly demonstrate the removal of a BGA component from a smart phone circuit board. To get a quote or obtain more information on the IR 1000, visit the link below: https://www.paceworldwide.com/products/area-array-bga-rework/bga-r
Industry News | 2012-07-19 13:24:57.0
Multitest, announces that its MT9928 gravity handler ideally supports the special features of the recently launched ecoAmp Kelvin contactor.
Industry News | 2013-01-18 16:47:20.0
AIM Solder announces that its VP of Technology Karl Seelig will present his paper titled “Conformal Coating Over No-Clean Flux” at the upcoming IPC APEX Expo
Industry News | 2014-07-15 14:38:39.0
Kyzen announces that it will exhibit AQUANOX® A4639 Electronic Assembly Aqueous Solution at the SMTA Philadelphia Expo & Tech Forum, scheduled to take place Tuesday, August 12, 2014 at the Crowne Plaza Philadelphia in New Jersey.
Industry News | 2018-10-11 19:44:24.0
KYZEN today announced that Mike Bixenman, DBA, will present three papers during the technical sessions at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL.
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
Enter PACE’s TF Series BGA/SMD Rework Systems. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF Series top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually an
New Equipment | Solder Materials
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for
Industry News | 2003-06-11 13:37:07.0
With efficiencies better or comparable to competing implementations in the MLF/QFN/Power Block packages, these new devices in the LITTLE FOOT SO 16 feature a 38% or smaller standard footprint, simplifying design, assembly, soldering, and layout.
