Used SMT Equipment | SPI / Solder Paste Inspection
KY8030-2L MFD : 2013 Very good working condition
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YOUNG KY8030-3L Manufacture year: 2017 Subject to prior sales.
Used SMT Equipment | SPI / Solder Paste Inspection
OMRON 3D-SJI /VT-S530-DU MACHINE
Used SMT Equipment | SPI / Solder Paste Inspection
condition is very good. inline If you want, pls contact me. thanks.
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Used SMT Equipment | SPI / Solder Paste Inspection
Vintage:2012 pcb size:330mm*330mm dimension:820(W)*1265(D)*1627(H) in stock
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Used SMT Equipment | SPI / Solder Paste Inspection
vintage:2016 pcb size:850mm*690mm camera resolution:20um dimension:1350(W)*1445(D)*1627(H) Will arrive at our warehouse in the end of August.
Used SMT Equipment | SPI / Solder Paste Inspection
We have Cyber Optics SE500 fro sale vintage 2011, L to R, front fix please contact if interest
Used SMT Equipment | SPI / Solder Paste Inspection
Make: Cyberoptics Model: LSM 500 Vintage: 1992 Details: Laser Section Microscope Benchtop Condition: Complete & Operational Location: LCI Nashua, NH / FOB Origin Availability: Immediate for purchase / 1-3 weeks for shipping
Used SMT Equipment | SPI / Solder Paste Inspection
we selling Koh Young Type: ASpire Yom:2008+ if need pls atten : steven wong Email: 13560819457@139.com
Technical Library | 2020-04-14 15:56:32.0
This paper will focus on the application requirements of solder printing small aperture designs, concentrating on 008004 (inch) / 0201 (metric) size components, and the results of a design of experiment printing these challenging apertures. As Moore's law continues to be applied to component miniaturization, the next installment of reduced packaging has arrived in the form of the 008004/0201 for resistors and capacitors. Component size roughly the size of a grain of sand presents specific challenges to the solder printing process. To address these challenges, each aspect of the printing process will need be examined. This includes essential machine requirements, including correct squeegee blades, tooling support, and calibrations, to meet the demanding specifications. The correct match and design of materials will be addressed, focusing on the stencil and substrate design along with solder paste and cleaning solvent requirements. A design of experiment will be reviewed that applies the machine and materials discussed, including the printer and Solder Paste Inspection (SPI) setup and the specific machine parameters used. The results of these DOE's will then be closely examined.
