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Electronics Forum | Fri Mar 09 15:13:49 EST 2012 | davef
Care must be taken to not apply an excess of material, as the adhesive will flow under the device during placement and curing, and could cause a short. Printer setup: * Don't worry about stencil thickness. A wide range of stencil thicknesses (typic
Electronics Forum | Fri Dec 06 13:00:29 EST 2002 | daanterstegge
I wouldn't recommend a metal squeegee, because if you can't wipe the step-etched area completely clean (that's the problem with metal) you'll have problems with the definition of the fine-pitch (it may stick in the holes). Best is a 70 Shore polyuret
Electronics Forum | Wed Sep 01 12:07:31 EDT 2010 | davef
Printing solder paste * Use single stroke, on-contact print cycle * Ensure the substrate is well supported, especially under areas of fine pitch print. * Select pressures of about 1- 2 lbs per linear inch of squeegee blade [Set squeegee pressure hig
Electronics Forum | Wed Sep 01 12:58:42 EDT 2010 | scottp
A good paste will print fine up to 5 in/sec or so. They key, as mentioned, is to get the pressure right for a given squeegee speed. If the squeegees aren't giving a clean wipe then you'll see huge variation in print volume which can lead to shortin
Electronics Forum | Mon Sep 17 15:27:51 EDT 2001 | jschake
Challenges: The basic defects that impact assembly yield are bridging, satellite solder balls, and opens (i.e. tombstones / draw bridges). There are many variables with the stencil printing process that can impact these; several of them are listed
Electronics Forum | Tue Apr 18 19:48:08 EDT 2006 | davef
There is no standard, nor should there be [because the IPC standards should be aimed at describing results, not the path used to reach the results]. So, your printer equipment supplier recommendations are a good starting point. Your "35-46 lbs-in"