Industry Directory | Manufacturer
Specialty and Low Volume Electronic Manufacturing, Cost Reduction Engineering, SMT Specialists
Industry Directory | Marketing Agency
At SRI Advertising, we handle all your advertising and marketing needs so that you can focus on your business.
BI2-M12-AN6X-H1141 NI4-M12-AN6X-H1141 NI8-M18-AP6X-H1141 BI5-M18E-AP6X-H1141 BI10-M30-AN6X4M BI10-M30-AN6X5M BI10-M30-AN6X7M BI10-M30-AN6X／S903M BI10-M30-AN6X-H1141 BI10-M30-AP6X BI10-M30-AP6X5M NI15-M30-AP6X7M NI15-M30-AP6X／S90 NI4-M12-RD4X5M BI5-M
Electronics Forum | Tue May 19 20:14:08 EDT 2009 | davef
We use epoxy to repair damaged pads
Electronics Forum | Tue May 19 03:19:33 EDT 2009 | cunningham
Has anyone used a hot press to bond new pads to the boards if they have been lifted? we have one and have tried and carried out some DOE's on FR4 boards but when trying the same settings on Polyamide they basically fell of can anyone give any pointe
Used SMT Equipment | Chipshooters / Chip Mounters
AUCTION ITEM -SRI NORTH AMERICA NOVEMBER 13-15 SIEMENS HS 60 CHIPSHOOTER 4 GANTRY 4 - FEEDER CARTS 2004 VINTAGE 67M PLACEMENT FEEDERS AVAILABLE AS WELL WWW.CARDINALCIRCUITAUCTIONS.COM
Used SMT Equipment | Soldering Equipment/Fluxes
Seho Power Selective - Selective soldering machine 2011 vintage - NEVER USED IN PRODUCTION selective spray fluxer LEAD FREE system Two lead free pots inline system - pass thru coneyor AUCTION ITEM - SRI NORTH America Absulote auction
Surface Mount Technology Association (SMTA)
Industry News | 2023-06-13 18:25:04.0
Electronics manufacturers to gather in Chennai August 1 and Pune, India, August 3
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Parts & Supplies | Pick and Place/Feeders
YAMAHA srying oil for clean nozzle KV8-M8870-00
Parts & Supplies | Assembly Accessories
spool ‘s rings XS01801AAA J1301696 O-RING J7256001 A C-RING (SHAFT) J2100158 LM BEARING J2100159 SUPPORT RING J130
Technical Library | 2024-07-24 00:51:44.0
A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 258C and 808C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.
Technical Library | 2021-05-13 16:03:25.0
Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutecticSn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed
Career Center | Kochchikade, Sri Lanka | Management,Production,Quality Control
We are a Swiss EMS company ISO 9000 / 14001 certified situated in Sri Lanka since 1988 with a staff count of 650 employees. Currently we go trough a major upgrade of our Facilities and Technology. Following positions need to be filled: 1 x Head of
Career Center | Esala_Senavirathne, Sri Lanka | Engineering,Maintenance,Research and Development,Technical Support
I am having autonomous mechanical and electronics system design, maintenance, installation,.
Career Center | Hyderbad, India | Engineering
i do not have any experiwnce.iam passedout b.tech in the strem of e.c.e in the year 2017.iam very intersted like passion to do job on electronics i liked sooo much that type of job.i will search about that job in seceredarbad.iam aslo stydying m.tech
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