Industry News | 2016-03-01 13:33:18.0
SAKI America will demonstrate its 3rd generation 3D automated optical inspection system at IPC APEX 2016, booth 1860. Saki's new 3D AOI, BF-3Di-Z1, accommodates XXL board sizes, offers dual-lane configurations, optional side angle cameras, and increases throughput by 15%. The 3D AOI system provides measurement of components with a height range from 0-20mm, achieving 1-micron height resolution, a false call rate of
Used SMT Equipment | Pick and Place/Feeders
JUKI KE760L / Zevatech FM760 : Completely working machine in good conditions, with some spare parts, nozzles renewed, spare mainboard/computer with LCD, manuals, etc. Supplied with 2troleys with about 70 various feeders, rack for spare feeders availa
Industry News | 2016-09-22 18:12:16.0
Saki Corporation will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International, September 27 and 28th, 2016, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full automation with very low false calls and zero escapes.
Classic PCB Profiling tools are used to create a repeatable thermal process that meets the specifications required by the solder paste and or component manufacturers. Only by profiling do you have any idea of what the actual temperatures are on the c
Industry News | 2021-10-14 13:46:26.0
Showcasing optimized automated inspection technology with extended measurement height capability for a wide range of applications and process inspections
Industry News | 2011-11-03 21:37:32.0
SEHO Systems introduces a new software function for its best-selling selective soldering system - the PowerSelective. The new function ensures even higher process reliability by compensating product or production-related warpage of the assemblies to be processed.
Speed and Flexibility for High Quality Production of any PCB With maximum speed up to 42,000CPH (Optimum) and 29,000CPH (IPC9850), the RS-1 is designed for maximum throughput. The RS-1 supports components from 0201 metric (008004") up to 74mm
Like all other VisionMaster equipment, the M500 uses advanced white light Moiré interferometry to build height data for every pixel in the view. VisionMaster honed this technology for SPI use and is the only manufacturer in the world deploying this
Description This device is designed to measure the shapes of 3-dimensional surfaces of objects that measure from dozen microns to a few millimeters, and is commonly used for measuring solder paste samples spread over PCBs automatically and 3-dimens
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