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Saki Demonstrates XL 3D AOI System and On-the-Fly Debugging Software at SMTA International Booth 726

Industry News | 2016-09-22 18:12:16.0

Saki Corporation will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International, September 27 and 28th, 2016, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full automation with very low false calls and zero escapes.

SAKI America

Thermal Profiling Accessories

Thermal Profiling Accessories

New Equipment | Reflow

Classic PCB Profiling tools are used to create a repeatable thermal process that meets the specifications required by the solder paste and or component manufacturers. Only by profiling do you have any idea of what the actual temperatures are on the c

Electronic Controls Design Inc. (ECD)

Saki to Exhibit Latest 3D-AOI Z-axis Innovation at NEPCON ASIA 2021

Industry News | 2021-10-14 13:46:26.0

Showcasing optimized automated inspection technology with extended measurement height capability for a wide range of applications and process inspections

SAKI America

Orbotech Announces New President

Industry News | 2003-01-27 09:36:56.0

Greater AOI Capabilities

Orbotech

SEHO PowerSelective: New Software Feature Ensures Highest Process Reliability

Industry News | 2011-11-03 21:37:32.0

SEHO Systems introduces a new software function for its best-selling selective soldering system - the PowerSelective. The new function ensures even higher process reliability by compensating product or production-related warpage of the assemblies to be processed.

SEHO Systems GmbH

RS-1 Smart. Fast. Modular

RS-1 Smart. Fast. Modular

Videos

Speed and Flexibility for High Quality Production of any PCB With maximum speed up to 42,000CPH (Optimum) and 29,000CPH (IPC9850), the RS-1 is designed for maximum throughput. The RS-1 supports components from 0201 metric (008004") up to 74mm

Southwest Systems Technology

VisionMaster M500 - Manual Benchtop 3D Solder Paste Inspection System

VisionMaster M500 - Manual Benchtop 3D Solder Paste Inspection System

New Equipment | Inspection

Like all other VisionMaster equipment, the M500 uses advanced white light Moiré interferometry to build height data for every pixel in the view.  VisionMaster honed this technology for SPI use and is the only manufacturer in the world deploying this

VisionMaster, Inc.

3D Master 3000 neo / wide - Table Top SPI System

3D Master 3000 neo / wide - Table Top SPI System

New Equipment | Inspection

Description This device is designed to measure the shapes of 3-dimensional surfaces of objects that measure from dozen microns to a few millimeters, and is commonly used for measuring solder paste samples spread over PCBs automatically and 3-dimens

Synapse Imaging Co., Ltd.

CircuitWorks

CircuitWorks

New Equipment |  

CircuitWorks is a fully integrated data interface between SolidWorks and PCB Design systems. Running totally inside SolidWorks, CircuitWorks will read an industry-standard IDF file, and produce a SolidWorks 3D Assembly of the PCB board fully populat

CircuitWorks from Zeal Solutions

CyberScan Vantage Measurement System

CyberScan Vantage Measurement System

New Equipment |  

CyberScan Vantage is a laser-based non-contact inspection system for scanning a target object. It combines proven laser sensor technology with computer driven X/Y translation stages. The system collects a series of Z height measurements with sub-mic

Cyber Technologies USA


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