Used SMT Equipment | Chipshooters / Chip Mounters
30 intelligent spindle assemblies -> All vision processing is performed “on the fly” to maximize throughput. -> Continuous updates of X, Y, and Z-height pickup and placement locations ● On-The-Head Cameras -> narrow field of view c
Used SMT Equipment | Pick and Place/Feeders
Type Pick and Place machineDimension off-line (L x W x H) 2150 x 1700 x 1500 mm (+500 mm for signal light)Dimension in-line (L x W x H) 1750 x 1300 x 1500 mm (+500 mm for signal light)Board thickness min. 0.5 mm - max. 4.5 mm thickBoard size min. 30
CircuitWorks is a fully integrated data interface between SolidWorks and PCB Design systems. Running totally inside SolidWorks, CircuitWorks will read an industry-standard IDF file, and produce a SolidWorks 3D Assembly of the PCB board fully populat
CyberScan Vantage is a laser-based non-contact inspection system for scanning a target object. It combines proven laser sensor technology with computer driven X/Y translation stages. The system collects a series of Z height measurements with sub-mic
CyberScan CT 300 is a laser-based non-contact inspection system for scanning a target object. It combines proven laser sensor technology woth computer driven X/Y translation stages. The system collects a series of Z height measurements with sub-mi
Industry News | 2020-04-18 13:55:53.0
Juki Automation Systems (JAS), Inc. is proud to offer the new, game-changing TAKUMI head, which is a dynamic height 8 nozzle placement head that automatically adjusts its height on the fly to optimize placement speed.
New Equipment | Wave Soldering
High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards. Microprocessor based digital controller that regulates solder temperature
New Equipment | Wave Soldering
High temperature, lead-free Soldering Fountain used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards. Microprocessor based digital controller that regulates solder temperature, wave height, and sold
The LineMaster Fusion is a revolutionary platform combining the best of ASC International’s 3D SPI sensor technology with its sophisticated image and algorithm based AOI sensor technology into a dual purpose, single source solution. Key Features & B
Industry News | 2016-03-01 13:33:18.0
SAKI America will demonstrate its 3rd generation 3D automated optical inspection system at IPC APEX 2016, booth 1860. Saki's new 3D AOI, BF-3Di-Z1, accommodates XXL board sizes, offers dual-lane configurations, optional side angle cameras, and increases throughput by 15%. The 3D AOI system provides measurement of components with a height range from 0-20mm, achieving 1-micron height resolution, a false call rate of
