Full Site - : standard solder mask thickness (Page 8 of 112)

IPC Delivers the First Automotive Standard on Performance Requirements for Rigid Printed Boards

Industry News | 2016-06-27 14:54:49.0

In September of 2015, IPC delivered revision D of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards. Building on this base standard, IPC has developed the first automotive addendum, IPC-6012DA, Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards.

Association Connecting Electronics Industries (IPC)

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SMT On-line 3D Solder Paste Inspection ?

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Dongguan Intercontinental Technology Co., Ltd.

IPC Issues Call for Participation for Electronics Materials Forum Presentations sought on emerging technologies

Industry News | 2019-04-14 18:51:44.0

IPC -- Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit presentation topics and descriptions for IPC Electronics Materials Forum, a new technical conference focusing on developments in materials and processes associated with electronics assembly and manufacturing. The conference will be held in Minneapolis, Minn., November 5-7, 2019.

Association Connecting Electronics Industries (IPC)

IPC Presents Technical Education Course: PCB Troubleshooting Course held in conjunction with PCB Carolina

Industry News | 2016-09-14 17:44:33.0

IPC – Association Connecting Electronics Industries® will present “PCB Troubleshooting” on November 2, 2016 in Raleigh, N.C. in conjunction with regional trade show, PCB Carolina.

Association Connecting Electronics Industries (IPC)

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Douglas Pauls Elected to Chair IPC's Top Standards Development Leadership Committee

Industry News | 2012-03-07 19:35:54.0

IPC announces the election of Douglas Pauls, principal materials and process engineer, Rockwell Collins, to chair the IPC Technical Activities Executive Committee (TAEC) for a two-year term. Elected to the position by the chairs and co-chairs of all IPC standards groups, Pauls succeeds Mel Parrish of STI Electronics, Inc. who held the role for IPC’s top standards development oversight committee for the past two years.

Association Connecting Electronics Industries (IPC)


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