Industry News | 2008-03-15 15:16:22.0
HUDSON, NH � March 13, 2008 � CeTaQ, the leader in quality analysis and optimization of SMT production processes, announces that its mobile measurement method is a perfect fit for statistical
CeTaQ Americas, LLC (formerly EAGLE-EYED ONE Sales & Service)
Career Center | Waterloo, Ontario Canada | Engineering,Research and Development
**To apply please send your resume to clapierre@rim.com** Research In Motion Limited� (RIM)� is a world leader in the mobile communications market and has a history of developing breakthrough wireless solutions. RIM's portfolio of award-winning prod
Technical Library | 2015-04-29 03:48:39.0
SPI equipment is routinely used in Printed Circuit Board (PCB) manufacturing to monitor and control one of the most crucial steps affecting the finished quality of circuit board. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry's first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process 3D inspection on the assembly line. SPI systems measure the height and volume of the solder pads before the components are applied and the solder melted, and when used properly, can reduce the incidence of solder-related defects to statistically insignificant amounts. Critical to the SPI measurement is the accuracy of the height measurement because that has a direct correlation with solder volume and defects.
Career Center | Palmdale, California USA | Management,Quality Control
Summary Plans, coordinates, and directs quality program designed to ensure quality control and quality assurance of the production of products consistent with established standards by performing the following duties personally or through subordinate
Technical Library | 2017-10-19 01:17:56.0
Wetting balance testing has been an industry standard for evaluating the solderability of surface finishes on printed circuit boards (PCB) for many years. A Wetting Balance Curve showing Force as a function of Time, along with the individual data outputs "Time to Zero" T(0), "Time to Two-Thirds Maximum Force" T(2/3), and "Maximum Force" F(max) are usually used to evaluate the solderability performance of various surface finishes. While a visual interpretation of the full curve is a quick way to compare various test results, this method is subjective and does not lend itself readily to a rigorous statistical evaluation. Therefore, very often, when a statistical evaluation is desired for comparing the solderability between different surface finishes or different test conditions, one of the individual parameters is chosen for convenience. However, focusing on a single output usually doesn't provide a complete picture of the solderability of the surface finish being evaluated.In this paper, various models here-in labeled as "point" and "area" models are generated using the three most commonly evaluated individual outputs T(0), T(2/3), and F(max). These models have been studied to quantify how well each describes the full wetting balance curve. The solderability score (S-Score) with ranking from 0 to 10 were given to quantify the wetting balance curve as the result of the model study, which corresponds well with experimental results.
Career Center | Atlanta, Georgia USA | Engineering,Production,Research and Development
US-Georgia-Sustaining Engineer Job Description: My client, a Global 100 provider of high-speed automated circuit board assembly systems seeks a Automation Systems Engineer to identify and address systemic problems and contribute to continious impr
New Equipment | Test Equipment
One platform embedded instruments for validation, test and debug (ScanWorks®) ScanWorks® tools validate, characterize and test chips and circuit boards in development, manufacturing and field service. Structural integrity tests can be re-used over t
Technical Library | 2020-08-27 01:15:10.0
Automobile surface defects like scratches or dents occur during the process of manufacturing and cross-border transportation. This will affect consumers' first impression and the service life of the car itself. In most worldwide automobile industries, the inspection process is mainly performed by human vision, which is unstable and insufficient. The combination of artificial intelligence and the automobile industry shows promise nowadays. However, it is a challenge to inspect such defects in a computer system because of imbalanced illumination, specular highlight reflection, various reflection modes and limited defect features. This paper presents the design and implementation of a novel automatic inspection system (AIS) for automobile surface defects which are the located in or close to style lines, edges and handles. The system consists of image acquisition and image processing devices, operating in a closed environment and noncontact way with four LED light sources. Specifically, we use five plane-array Charge Coupled Device (CCD) cameras to collect images of the five sides of the automobile synchronously. Then the AIS extracts candidate defect regions from the vehicle body image by a multi-scale Hessian matrix fusion method. Finally, candidate defect regions are classified into pseudo-defects, dents and scratches by feature extraction (shape, size, statistics and divergence features) and a support vector machine algorithm. Experimental results demonstrate that automatic inspection system can effectively reduce false detection of pseudo-defects produced by image noise and achieve accuracies of 95.6% in dent defects and 97.1% in scratch defects, which is suitable for customs inspection of imported vehicles.
Career Center | Palmdale, California USA | Quality Control
Plans and conducts activities concerned with the quality control and quality assurance of industrial processes, materials, and products by performing the following duties. Develops and initiates standards and methods for inspection, testing, and eva
Industry News | 2010-05-05 21:05:42.0
NASHVILLE — Kyzen, the world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Dr. Mike Bixenman will present a paper titled "Improving the R.O.S.E. Process Control and Quality Assurance Method" at the upcoming International Conference on Soldering and Reliability (ICSR), which is co-located with the Lead-Free Academy and SMTA Toronto Expo and Tech Forum.
