ORPRO Vision AOI Presentation. This presentation introduces the methods and technology used by ORPRO Vision in the Symbion S36 Plus and Vantage S22 Plus AOI systems. For additional information, please contact ORPRO Vision at sales.us@orprovision.co
ScanCAD offers a family of modular products to assist in the PCB Reverse Engineering Process. Start from a PCB or set of films to generate all the needed data and files (from BOM to Schematic) to manufacture or repair legacy parts. Precise form, fi
Used SMT Equipment | In-Circuit Testers
Fujikura FSM-60S FSM-60S Fusion Splicer Kit (with cleaver) - The FSM60S fusion splicer sets the standard for core alignment fusion splicing by incorporating a user-friendly interface with enhanced features to provide the most rugged and reliable
Used SMT Equipment | General Purpose Test & Measurement
Fujikura FSM-60S FSM-60S Fusion Splicer Kit (with cleaver) - The FSM60S fusion splicer sets the standard for core alignment fusion splicing by incorporating a user-friendly interface with enhanced features to provide the most rugged and reliable
Used SMT Equipment | In-Circuit Testers
The LV5333 is a great and powerful tool in a compact and portable product. Just like its predecessor, the LV5333 boasts a 6.5 high-fidelity TFT LCD screen for high quality picture images. Waveform, Vectorscope, Audio, 5-bar Display, and Status analy
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
New Equipment | Cleaning Equipment
The PBT range of products covers all cleaning processes applied in PCB and electronics assembly technology—water-based as well as other kinds of cleaning systems. PBT offers several different micro-mechanics applications, such as spray or ultrasonic,
Yamaha Motor Co., Ltd. has developed the new YSP20 D×D Printer, a solder-paste (cream solder) printer that adopts dual-stage, dual-stencil printing to achieve an extremely fast printing speed and a variety of new and unique functions at the same time
Industry News | 2010-08-10 10:43:15.0
APS Novastar's new video provides an overview of its SPR line of Stencil Printers for printed circuit board (PCB) assembly and demonstrates the ease of product set up and use.
Career Center | Reading, Pennsylvania USA | Production,Technical Support
Job Title: Surface Mount Technology Operator Department: Production Department Reports To: Production Manager FLSA Status: Non-Exempt Summary: Responsible for monitoring, maintaining, and adjusting equipment used to create electronic circuits w
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