Electronics Forum | Mon Sep 13 04:11:27 EDT 1999 | Earl Moon
| | hello | | | | having a problem with one customers bare boards not matching my stencil apertures. i design stencils based on gerber data and reduce up to 15% on some pads. do some board houses reduce pads after receiving gerber data???why would
Electronics Forum | Fri Jun 15 09:16:46 EDT 2001 | adam
Thanks Dave. About your second comment, the issue is placing BGA connectors mirror image (male, and female), the connector sometimes shifts during placement before reflow. we are using a six mil stencil for both sides with minimum paste deposit. a
Electronics Forum | Tue Aug 31 02:15:12 EDT 2004 | AOI Solution
I need to address the issue for colorful display on solder joints, for whoever researched on this machine, no one can deny it is a smart feature for visual assistance. however, it is still Mono color "gray scale" algorithm. it basically "paint" the i
Electronics Forum | Mon Sep 17 03:59:52 EDT 2012 | stivais
Hi guys, We have an interesting case we haven't seen before (see the picture below) http://postimage.org/image/lu2f4ae55/ Solder balls form on unpopulated pads after reflow. 1. Reflow profile is fine. 2. Stencil thickness / paste volume is also f
Electronics Forum | Fri May 31 12:50:42 EDT 2013 | spoiltforchoice
Is this a "thermal balance" issue? In the 2nd image you have a group of pads blobbed together as one giant pad. IMHO this is a bad idea, QFN's rely heavily on the magic of your paste and good PCB design to get good alignment. When your solder paste i
Electronics Forum | Fri Jul 07 12:44:49 EDT 2017 | tsauve
The problem is registration between the stencil & the smallest pads on the 5 substrates. Using SPI s/w I can overlay the paste layer over the PCB image to determine stretch/shrink. Our worst case was shrinkage of 10.2mil on a 5-up 300mm panel - small
Electronics Forum | Thu Jun 20 23:28:15 EDT 2019 | SMTA-David
How can I upload image to this forum? I can show you the pad layout. I am thinking maybe too much solder. I used 0.16mm thick stencil but notice many us 0.12mm thickness. Also, cream layer is 100% of pad surface, I know for fine pitch parts it is r
Electronics Forum | Thu Aug 22 22:19:13 EDT 2019 | sssamw
From the picture you present, it is a pin in paste part with pin length 2.2mm (a good length for 1.6mm PCB thickness), and seems the pin tilted and touch on PCB surface, thus causes up-part. Sorry I cannot image pin tilted not before placement but i
Electronics Forum | Sat Feb 12 20:02:04 EST 2005 | Mike Konrad
As for specific recommendations, I�ll defer to �real users�. But here are the usual suspects: Aqueous Technologies http://www.aqueoustech.com (909) 944-7771 Ultrasonic Smart Sonic http://www.smartsonic.com (818) 610-7900 Ultrasonic PMR http://www
Electronics Forum | Thu Mar 25 09:38:36 EDT 2021 | spoiltforchoice
Well everything Graham said with some additional points.. You mention manual printing but very little about your stencil or setup. Everything you have said indicates a very limited budget has been expended, however what you have is an extreme exampl
