Electronics Forum | Fri Apr 21 23:17:29 EDT 2006 | SD
Well, my first thought is that you need to consider lead-free rework. Depending on the alloy, some stations may not be able to reach the correct temperature. The best stations I have seen have a prism & shows both the pads and the BGA on a single v
Electronics Forum | Wed Jan 17 09:32:09 EST 2007 | Jeff
Hi, I am having problems reworking a lead free PBGA (23mm x 23mm, 1mm pitch). The board is relatively small (5" X 4" X 0.063"). During the removal stage, a thermocouple was placed at the solder ball level (between the board and underneath of compo
Electronics Forum | Thu Dec 18 13:05:59 EST 2008 | tsvetan
we have omron, before buy I have evaluated lot of other machines, what I like most is the three ring at different angle lighting which allows pseudo 3-d solder joint evaluation and historgams with statistics, you can see out of total solder joints ho
Electronics Forum | Mon Apr 14 17:38:18 EDT 2014 | bradlevy
I've got a small smt board I've already got working prototypes of, which uses a tactile switch. I've got another much less expensive tact switch of similar size that I had avoided due to a difference in actuators I originally had no way around. Now I
Electronics Forum | Tue Sep 08 13:12:05 EDT 2020 | spoiltforchoice
> Tombstone is often caused by an imbalance of > temperature, pad shape or spacing, component > termination, and component positioning. Pate > formulation and reflow atmosphere are other > common causes. Looking at the pads and &
Electronics Forum | Thu Jan 13 03:56:45 EST 2022 | goseese
Hello, and thank you in advance for your help. I have just received a used DEK 03i and I am having a problem that I don't know exactly how to troubleshoot. The DEK will power up correctly and everything will initialize. When I try to set up a n
Electronics Forum | Tue Jun 06 14:26:00 EDT 2023 | spoiltforchoice
> In Hungary there are many EKRAs. Bosch, Zollner > and many big/small company are using them. I also > saw the latest DEK but I think DEK is > over-complicated, fast and good printer - but if > you have any problem, it cost a lot.
Electronics Forum | Mon Aug 16 07:54:05 EDT 1999 | Peter Barton
| | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact w
Electronics Forum | Wed Aug 18 21:03:41 EDT 1999 | Dave F
| | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact
Electronics Forum | Thu May 21 20:06:12 EDT 1998 | Bill Schreiber
| Y'all: IPC set-up a site addressing the environmental issues of the printed circuit fabrication industry. Some of it is interesting and applicable to the assembly business as well, even though not aimed directly at assemblers. IPC has recently t
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