Full Site - : stencil aperture for dpak (Page 11 of 14)

Cpk Variables Control for Paste Printing

Electronics Forum | Wed Apr 03 13:42:49 EST 2002 | Bob

Just one minor point to bear in mind, most stencils have tapered apertures. If you want to get really accurate volumes you will need to work put the volume based on the taper of the walls. Probably going to far but at least you can sound knowledgeab

SPC for MPM UP1500 Stencil Printers

Electronics Forum | Thu Sep 26 20:25:06 EDT 2002 | davef

When we DOE a board, we use the following independent print variables: * Print pressure * Print speed * Separation speed * Aperture orientation * Squeegee hardness

Solder Volume for Lower Profile PBGA

Electronics Forum | Thu Sep 29 20:26:58 EDT 2005 | DasonC

Any aperture/stencil thickness suggestion to provide a rigid solder joint for 0.8mm pitch PBGA with 0.4mm ball diameter. The pad is based on IPC7095 and it is 0.3mm. Thank!

Re: no-clean mask for gold fingers

Electronics Forum | Mon Jan 25 13:51:07 EST 1999 | Parvez PAtel

Steve i agree with u. we use kapton tapes for test puproses at our facility and they do not interfere with the printing results. Infact we sometimes use it to mask off unwanted apertures on stencil underside. But could their applcation affect the gol

Flux dip or solder print for CSP

Electronics Forum | Tue Jan 31 09:41:06 EST 2017 | emeto

If there is no specific quality reason, stay with paste. More processes you add, more points of failure. They don't need a lot of paste to get attached to the board. The ones I used were 8mil round apertures, so I did cut 1:1 on a 3 mil coated stenci

Re: Capability Study for Solder Printing Process

Electronics Forum | Tue Jan 23 22:38:43 EST 2001 | rpereira

I have recently completed a HUGE screen-printing DOE. I used Taguchi methodology and man I got good results! Here is what I learned for what it's worth: (p.s. to the MPM apps guy I sent a copy to Tim Gillis, Lou Fuda, etc...) EFab vs. Laser: EFab

Re: Capability Study for Solder Printing Process

Electronics Forum | Thu Sep 21 05:46:34 EDT 2000 | Wolfgang Busko

Once you know what your print should look like, means you have found the right apertures, stencil thickness, stencil finish and the right printer adjustments and alignments, the main things to watch for or better to control when printing is in progre

Re: Aperture Reduction for QFP (fine pitch)

Electronics Forum | Tue Sep 21 13:12:56 EDT 1999 | Dave F

| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | Greg: I was going to link you to the IPC land pattern c

Solder Volume for Lower Profile PBGA

Electronics Forum | Fri Sep 30 19:14:35 EDT 2005 | DasonC

The stencil is 5 mil thick and the aperture is 12 mil sq. We found open but can't detect by x-ray. The process which we are using is no clean TIN/LEAD. Just thinking the ball size variance from 0.35~0.45mm per IPC-7095, in worst case scenarios, th

Flux dip or solder print for CSP

Electronics Forum | Wed Feb 01 11:33:37 EST 2017 | emeto

Joshua, 100um is 4mil aperture. You should ask several stencil houses about the possibility to print that small amount of paste(type 6 paste is available now with very small solder spheres 5-15um diameter). Even applying small amount(thin layer of f


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