Technical Library | 2023-06-12 19:00:21.0
The SMT print process is now very mature and well understood. However as consumers continually push for new electronic products, with increased functionality and smaller form factor, the boundaries of the whole assembly process are continually being challenged. Miniaturisation raises a number of issues for the stencil printing process. How small can we print? What are the tightest pitches? Can we print small deposits next too large for high mix technology assemblies? How closely can we place components for high density products? ...And then on top of this, how can we satisfy some of the cost pressures through the whole supply chain and improve yield in the production process! Today we are operating close to the limits of the stencil printing process. The area ratio rule (the relationship between stencil aperture opening and aperture surface area) fundamentally dictates what can and cannot be achieved in a print process. For next generation components and assembly processes these established rules need to be broken! New stencil printing techniques are becoming available which address some of these challenges. Active squeegees have been shown to push area ratio limits to new boundaries, permitting printing for next generation 0.3CSP technology. Results also indicate there are potential yield benefits for today's leading edge components as well. Stencil coatings are also showing promise. In tests performed to date it is becoming apparent that certain coatings can provide higher yield processing by extending the number of prints that can be performed in-between stencil cleans during a print process. Preliminary test results relating to the stencil coating technology and how they impact miniaturisation and high yield processing will be presented.
Technical Library | 2018-06-13 11:42:00.0
The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However, the impending introduction of passive Metric 0201 devices has reopened the need to re-evaluate the printing process and the influence of stencil architecture. The impact of introducing apertures with architectural dimensions’ sub 150um whilst accommodating the requirements of the standard suite of surface mount connectors, passives and integrated circuits will require a greater knowledge of the solder paste printing process.The dilemma of including the next generation of surface mount devices into this new heterogeneous environment will create area ratio challenges that fall below todays 0.5 threshold. Within this paper the issues of printing challenging area ratio and their associated aspect ratio will be investigated. The findings will be considered against the next generation of surface mount devices.
Industry News | 2023-10-31 19:19:30.0
StenTech® Inc. today announced that it received an esteemed 2023 Mexico Technology Award in the category of Screen/Stencil Printing Consumables. The award celebrates StenTech's revolutionary Advanced Nano Coating, a groundbreaking technology that sets a new benchmark for stencil performance and precision. The award was announced at a ceremony that took place Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.
Industry News | 2015-07-20 07:36:12.0
SMTA/NPL Printing & Assembly Automatic Optical Inspection Experience is a special feature we are organising in Chicago this year and we are looking for Solder Paste Inspections SPI and Automatic Optical Inspection systems to test our specially produced boards. If you would like to show your technology contact us bobwillis@smta.org
Industry News | 2022-11-29 07:29:41.0
StenTech Inc. is pleased to offer customers the ability to easily place stencil orders online with its new Online Order Management System.
Industry News | 2023-01-30 16:10:55.0
StenTech® Inc. received a 2023 CIRCUITS ASSEMBLY NPI Award in the category of Screen/Stencil Printing Peripherals/Consumables for its new Advanced Nano Coating. The award was announced during a ceremony that took place Monday, Jan. 23, 2023 in San Diego.
Industry News | 2008-09-08 18:17:57.0
Essemtec's new stencil printer SP003-ML-V is a highly reliable system aimed at small and medium production volumes. Control of print quality and correction of print position is made easy and fast using the integrated vision system.
Industry News | 2016-09-28 10:06:01.0
KYZEN announces that its AQUANOX® A8820 Advanced Aqueous Stencil Cleaner provides many user benefits.
Industry News | 2013-12-10 12:14:34.0
Indium Corporation introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium's unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.
Industry News | 2016-05-05 20:48:30.0
KYZEN announces that it has been awarded the 2016 EM Asia Innovation Award in the category of Cleaning Materials for its AQUANOX® A8820 Advanced Aqueous Stencil Cleaner. The award was presented to the company on April 26, 2016 at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
