Electronics Forum | Sat Dec 04 09:23:20 EST 1999 | Christopher Lampron
Kantesh, Does this particular part have a heat sink across the bottom side of the component and does your pad size and stencil aperture match the component? I have just had a very similar problem with a DPAK. What we found was that the recomended pad
Electronics Forum | Thu Mar 08 14:30:45 EST 2007 | ratsalad
If you are in the middle of a run and can't get a replacement stencil there immediately, you can always put a little kapton tape on the bottom of the stencil to mask off a portion of the DPAK pad and reduce the paste deposit. We have had to do this
Electronics Forum | Thu Aug 13 14:10:01 EDT 2015 | markhoch
Hi Sam, I have a feeling that what you're trying to communicate is that your DPAK's are skewing off the pad during reflow. This is caused by a thermal "mismatch" where the solder paste on one side of the DPAK becomes molten before the other, then th
Electronics Forum | Thu May 03 17:33:20 EDT 2018 | dleeper
Solder paste selection can have a huge impact on size and quantity of voids. Talk to a few suppliers and ask for their recommendation on low voiding formulas. Pick a few of your top candidates and then perform a DOE to see who has the best result. S
