Industry News | 2010-04-14 20:57:38.0
From the recently re-energized Horizon platform, through to comprehensive print process control tools and next-generation stencil technologies, the DEK display at Nepcon Shanghai will treat booth visitors to the ultimate in print productivity. Being held from 20th – 22nd April at the Everbright Convention & Exhibition Centre, the twentieth Nepcon Shanghai event will see DEK demonstrate a selection of advanced products and processes from booth 1E08.
Industry News | 2016-02-02 12:18:54.0
Gen3 Systems Limited is pleased to announce that it will exhibit in Booth E19 at Southern Manufacturing, scheduled to take place Feb. 9-11, 2016 at FIVE in Farnborough, Hampshire.
Industry News | 2017-03-07 09:28:32.0
Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that it will exhibit on stands J19 and J20 at Southern Manufacturing, scheduled to take place March 21st – 23rd at FIVE in Farnborough, Hampshire.
Industry News | 2018-01-16 10:38:59.0
Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that it will exhibit on stands F35 and F60 at Southern Manufacturing, scheduled to take place February 6th – 8th at FIVE in Farnborough, Hampshire.
Industry News | 2022-01-25 08:46:41.0
Gen3 Systems Limited, a specialist British manufacturer and distributor, is pleased to announce that it will exhibit on stand L160 at Southern Manufacturing, scheduled to take place February 8th – 10th at FIVE in Farnborough, Hampshire.
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Industry News | 2022-09-26 06:33:54.0
Horizon Sales is pleased to announce that it received a 2022 Mexico Technology Award in the category of Cleaning Equipment for its new Mobile Sonic Stencil Cleaning System. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.
Industry News | 2013-09-13 13:53:44.0
FCT Assembly announces that it will exhibit its new NanoSlic™ stencil in Booth #410 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Industry News | 2013-02-20 08:38:42.0
FCT Assembly announces that it has been awarded a 2013 NPI Award in the category of Coatings/Encapsulants for its NanoSlic™ Nano Coating.
Industry News | 2015-11-17 12:24:20.0
November 17, 2015 -- At last week’s Productronica event held in Munich, Germany, FCT Assembly was honored with a Global Technology Award for its new, VOC-free stencil coating, NanoSlic® (www.nanoslic.com). This award win comes on the heels of several successes for NanoSlic, including recent expansion of the company’s licensing network and increased use of the coating technology among global electronics manufacturing firms.
