Electronics Forum | Thu Jun 22 10:27:26 EDT 2000 | Igmar
Can someone please help with the aperture size on a Micro BGA stencil. I want to have an electroformed stencil made with 0.1mm (4mil) thickness. The PCB pad for the micro BGA has a 0.406mm (16mil) diameter. What size should I make the apertures for t
Electronics Forum | Thu Jun 22 11:21:59 EDT 2000 | Chrys Shea
My personal opinion: Use 20 mil squares with the corners radiused at 5 mils. The squares offer 2 benefits: 1) A little more paste, which makes for a higher diameter solder column that is more reliable 2) Better stencil release of the paste. It's e
Electronics Forum | Fri Jun 23 09:54:20 EDT 2000 | Dave F
Igmar: Chrys and JAX make good points. I'd like to add that you should be careful that you don't starve larger chip components of solder when using a 4 thou stencil.
Electronics Forum | Fri Dec 10 10:25:59 EST 1999 | Wolfgang Busko
Hi Larry, you might find something looking for the thread "D-Pak misalignment Problem - Kantesh Doss 23:43:23 12/02/1999" Good luck Wolfgang
Electronics Forum | Sun Dec 08 23:40:19 EST 2002 | nonotalent
Hi all, We are currently having problems with > a laser-cut stencil that is electropolished and > nickel plated with 9-mil openings. The paste > does not release well from the apertures. We are > having to wipe after every print. The board is >
Electronics Forum | Mon Sep 23 09:55:12 EDT 2013 | emeto
Hi, just for the package you have you will see 20 different designs for the ground pad. Some will be 1:1 with the part some will be 3 times bigger than the part ground contact. I would always print according to the part and will always do a windowpa
Electronics Forum | Mon Sep 23 02:54:40 EDT 2013 | pradeep_selec
We are using Dpak package & I would like to know which is the best Aperture shape for DPAK, whether is there any problem if the Aperture of Ground pad is made of the same shape & size as the pad & what are the possible issues faced with it. Can I hav
Electronics Forum | Tue Sep 24 10:09:52 EDT 2013 | leigh
Windowpane your ground planes, this will prevent a lot of voiding.
Electronics Forum | Fri Oct 11 16:25:43 EDT 2013 | scdunlap
Also coplanarity can be poor on these parts so overprinting the paste (beyond the pad perimeter) can increase volume to insure robust solder joint.
Electronics Forum | Fri Jan 19 06:52:36 EST 2001 | pteerink
We have had the same problem with several boards, and the problem was with the land pattern design on the PCB, not the stencil. We found that the part tends to center itself on the one large pad, and if the two smaller pads are not the right distance
