Electronics Forum | Thu Nov 10 15:43:10 EST 2005 | 1st Article
myu, Is using a 0.6mm stencil wise? 42.5 X 42.5 has two models, the 1mm pitch has 41x41 array with 1657 I/O and the 1.27mm pitch has 33x33 with 1088 I/O. For a typical c-cga with 1.0mm - 1.27mm pitch, may requires a 2mil stencil, 1.0mm pitch gets .
Electronics Forum | Mon Feb 19 10:04:21 EST 2007 | realchunks
It's a nasty little part, but usuallu solders well. Now your inspectors will thing it's not soldered and try and touch it up, but generally, the exposed leads are not tinned, and will not toe fillet. If they know this up front they won't over heat
Electronics Forum | Wed Feb 11 00:34:42 EST 2015 | comatose
There isn't going to be much worthwhile used equipment out there if you mean true jetting - it is a pretty recent process. There are lots of used stencil printers out there, so from an up-front cost perspective, stencil wins. Jetting is slow. A hig
Electronics Forum | Sat Aug 21 12:38:09 EDT 1999 | Earl Moon
| Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | Anyone working on this , please help out. | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through prototypi
Electronics Forum | Sun Aug 22 08:21:39 EDT 1999 | Earl Moon
| | | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | | Anyone working on this , please help out. | | | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went t
Electronics Forum | Sat Aug 21 17:10:12 EDT 1999 | K. Vikas Sharma
| | Want to know the Tools/ Process required to get started with CSP prototyping and R & D. | | Anyone working on this , please help out. | | | Depending on the type, size, and pitch - just like BGA's, they aren't tough. Our 1mm types went through p
Electronics Forum | Mon Sep 20 20:51:36 EDT 1999 | Greg H.
My stencil thickness is 6 mil and we got qfp's with fine pitch. how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? thanks
Electronics Forum | Mon Nov 13 08:24:03 EST 2000 | G. English
Richard, From your description of the IC, as Wolfgang indicates it sounds like a 20mil pitch device, the aperture design really depends upon your solder paste particle size, we use a type 3 solder paste with a mesh size of �325 / +500microns. This is
Electronics Forum | Fri Feb 19 03:57:48 EST 1999 | Mark Alder
Please could you suggest a recommended aperture sizes for printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated.
