Electronics Forum | Mon Sep 20 06:21:05 EDT 2004 | C Lampron
Hi Chris, Acually, it worked pretty good. We made a new blade from SS. We were not sure if it would work so we diddn't want to commit a good sqeegee blade. You will want to try to keep the cutaway toward the center of the blade. And don't hit the fl
Electronics Forum | Fri Sep 17 09:31:33 EDT 2004 | C Lampron
Hi Chris, It sounds like you may have to go with your idea of a relief cut into the stencil. Are there any components that need to be printed in close proximity? Is this a high volume?I used to work at a flex house and we had a similar situation. We
Industry News | 2012-01-07 21:33:05.0
To support the consistent and rapid growth in Eastern Europe’s electronics assembly industry, IPC will hold its second annual IPC Conference on Electronics Assembly: Soldering, Assembly & Inspection in Budapest, Hungary, on 20-22 March 2012. This three-day event includes workshops, a two-day technical conference and a tabletop exhibition, providing myriad opportunities for participants to network with industry experts and gain insight into new technologies and trends in this key market.
Industry News | 2018-12-08 03:27:35.0
Printed Circuit Board (PCB) for Surface Mount Technology (SMT)
Technical Library | 2023-05-02 19:06:43.0
As 0402 has become a common package for printed circuit board (PCB) assembly, research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. In this study, a test vehicle for 0201 packages was designed to investigate board design and assembly issues. Design of Experiment (DOE) was utilized, using the test vehicle, to explore the influence of key parameters in pad design, printing, pick-andplace, and reflow on the assembly process. These key parameters include printing parameters, mounting height or placement pressure, reflow ramping rate, soak time and peak temperature. The pad designs consist of rectangular pad shape, round pad shape and home-based pad shape. For each pad design, several different aperture openings on the stencil were included. The performance parameters from this experiment include solder paste height, solder paste volume and the number of post-reflow defects. By analyzing the DOE results, optimized pad designs and assembly process parameters were determined.
Imagineering, Inc. | https://www.pcbnet.com/blog/what-is-a-flex-pcb/
to rigid boards Good temperature range makes flex PCBs suitable for harsher environments High Circuit Density Disadvantages Higher materials cost than rigid printed circuit boards Complex assembly
Blackfox Training Institute, LLC | https://www.blackfox.com/4-key-attributes-that-pcbs-need-for-aerospace-deployment/
. That amount of mechanical abuse can take a lot of toll on rigid boards due to their lesser bendability range than flex boards. For PCBs to withstand the excessive shock and vibration, manufacturers often alter the design of some boards, like combining pins and soldering to hold components in place or leaving a small space
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