Full Site - : stencil design for qfns (Page 3 of 43)

MPM Announces New EdgeLoc Board Clamping and Board Staging Options for Edison Printers

Industry News | 2020-04-14 22:07:07.0

ITW EAE is announcing new features for the MPM® Edison™ Printer. Board staging, designed to meet the demands from Automotive manufacturers for reduced cycle time, will now be a feature on the Edison. And the new EdgeLoc™ II is a robust addition to the side-clamming capability on the Edison.

ITW EAE

IPC Releases T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Industry News | 2015-06-18 17:23:06.0

IPC Association Connecting Electronics Industries® has released IPC-T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. This ever evolving standard provides common language of terms and definitions for the electronics industry.

Association Connecting Electronics Industries (IPC)

ITW EAE Wins Vision Awards for MPM Paste Management System and Electrovert Adjustable Wave

Industry News | 2020-08-28 03:07:38.0

ITW EAE is proud to announce that it has earned two Vision Awards for innovative MPM and Electrovert technology developments. MPM received a Vision Award for a new paste monitoring system featuring temperature monitoring as well as upper and lower limit roll-height monitoring. Electrovert received a Vision Award for the new DwellFlex 4.0 variable contact wave solder nozzle. The awards were presented at NEPCON Asia.

ITW EAE

IPC Unveils New Training Courses and Subscription Model for the Electronics Workforce

Industry News | 2023-10-02 10:05:09.0

IPC continues to collaborate with the electronics manufacturing industry to meet their current and future workforce training needs. This collaboration includes expanding its course offerings to include self-paced courses on soldering, inspection, and manufacturing engineering. With the introduction of eight new training courses in 2023, IPC reaffirms its commitment to ensuring that professionals in electronics manufacturing remain at the forefront of the industry.

Association Connecting Electronics Industries (IPC)

Find Inspiration for Innovation with New IPC APEX EXPO Activities in 2011

Industry News | 2011-01-12 17:40:04.0

Check out these Show Highlights, Ways to Save, Networking and Educational Opportunities, and Exhibition Preview.

Association Connecting Electronics Industries (IPC)

IPC Conference on Electronics Assembly in Budapest Offers Critical Information for Eastern Europe’s Fast-Growing Industry

Industry News | 2012-01-07 21:33:05.0

To support the consistent and rapid growth in Eastern Europe’s electronics assembly industry, IPC will hold its second annual IPC Conference on Electronics Assembly: Soldering, Assembly & Inspection in Budapest, Hungary, on 20-22 March 2012. This three-day event includes workshops, a two-day technical conference and a tabletop exhibition, providing myriad opportunities for participants to network with industry experts and gain insight into new technologies and trends in this key market.

Association Connecting Electronics Industries (IPC)

Session 6 Agenda Is Finalized for the High-Rel Cleaning and Coating Conference Hosted by IPC and SMTA

Industry News | 2012-11-07 11:01:55.0

IPC and SMTA jointly announce the agenda for Session 6 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.

Association Connecting Electronics Industries (IPC)

Come. Focus. Participate in the industry's best conference. The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference.

Industry News | 2010-05-07 16:01:14.0

New this year! The SMTA International Technical Committee invites you to participate in a poster session at SMTA International. Poster sessions are presented on the show floor and are a great way to present current research and results in a concise manner without requiring a technical paper.

Surface Mount Technology Association (SMTA)

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

The SMTA Capital Chapter’s Expo and Tech Forum to be Held on September 10, 2013

Industry News | 2013-07-30 16:31:28.0

he SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on September 10, 2013 from 9:00 am until 3:30 pm.

Surface Mount Technology Association (SMTA)


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