Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Technical Library | 2014-03-13 15:25:01.0
A student competition paper at Budapest University of Technology And Economics, Department of Electronics Technology gives background, covers stencil design and discusses stencils intended for pin in paste application. The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production.
http://www.ddmnovastar.com/stencil-printers - DDM Novastar Stencil Printers are designed for short to medium run PCB assembly. Ranging from manual to semi-automatic, these durable, easy-to-use systems provide repeatable, reliable results. Greatly r
http://www.ddmnovastar.com/stencil-printers - DDM Novastar Stencil Printers are designed for short to medium run PCB assembly. Ranging from manual to semi-automatic, these durable, easy-to-use systems provide repeatable, reliable results. Greatly r
http://www.ddmnovastar.com/stencil-printers - DDM Novastar Stencil Printers are designed for short to medium run PCB assembly. Ranging from manual to semi-automatic, these durable, easy-to-use systems provide repeatable, reliable results. Greatly r
Industry News | 2005-03-18 12:10:43.0
New pick & place series FLX2010-MK (MK=Membrane Keyboard)
http://www.ddmnovastar.com/stencil-printers - DDM Novastar Stencil Printers are designed for short to medium run PCB assembly. Ranging from manual to semi-automatic, these durable, easy-to-use systems provide repeatable, reliable results. Greatly r
Technical Library | 2015-08-25 13:51:27.0
The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: "faster and smaller" it is necessary to place components with different paste volume close together without regard to solder paste printing. In our days it is no longer possible to control the solder paste volume only by adjustment of the aperture dimensions. The requirements of solder paste volumes for specific components are realized by different thicknesses of metal sheets in one stencil with so called step stencils. The step-down stencil is required when it is desirable to print fine-pitch devices using a thinner stencil foil, but print other devices using a thicker stencil foil. The paper presents the innovative technology of step-up and step-down stencils in a laser cutting and laser welding process. The step-up/step-down stencil is a special development for the adjustment of solder paste quantity, fulfilling the needs of placement and soldering. This includes the laser cutting and laser welding process as well as the resulting stencil characteristics and the potential of the printing process.
