Industry News | 2011-04-25 11:39:29.0
Speedprint, part of the Blakell Europlacer Group, announces the appointment of Mark Brawley to the position of VP Speedprint Americas.
Technical Library | 2008-03-18 12:36:31.0
This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required. The board contains standard SMD, chipset BGAs, connectors, through hole components and odd forms placed using full automation and soldered after two reflow cycles under critical process parameters. However, state of the art technology does not help if the process parameters are not set carefully. Can all complex BGAs, THTs and even screws be soldered on a single stencil? What will help us overcome bridging, insufficient solder and thombstoning issues? This paper will demonstrate the placement of all odd shape components using pin-in-paste stencil design and full completion of the motherboard after two reflow cycles.
Industry News | 2023-10-31 19:06:43.0
Scienscope International proudly announces its victory at the 2023 Mexico Technology Awards in the Component Storage Rack System category. The company's game-changing Smart Racks for Reels, Stencils and Feeders were recognized at a ceremony that took place Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.
Industry News | 2023-10-31 19:19:30.0
StenTech® Inc. today announced that it received an esteemed 2023 Mexico Technology Award in the category of Screen/Stencil Printing Consumables. The award celebrates StenTech's revolutionary Advanced Nano Coating, a groundbreaking technology that sets a new benchmark for stencil performance and precision. The award was announced at a ceremony that took place Wednesday, Oct. 25, 2023 during the SMTA Guadalajara Expo in Mexico.
The LPKF ZelFlex Z4P is a pneumatic 4-sided high-speed clamping frame for stencils. More information: http://www.lpkf.com/products/rapid-pcb-prototyping/smd-assembly/quick-release-frames/zelflex-z4p.htm?utm_source=youtube&utm_medium=social&utm_term=s
Technical Library | 2015-06-11 21:20:29.0
The use of bottom terminated components (BTC) has become widespread, specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type, improved electrical and thermal performance relative to older packaging technology, and low cost make the QFN/BTC attractive for many applications.Over the past 15 years, the implementation of the QFN/BTC package has garnered a great amount of attention due to the assembly and inspection process challenges associated with the package. The difference in solder application parameters between the center pad and the perimeter pads complicates stencil design, and must be given special attention to balance the dissimilar requirements
Industry News | 2023-05-30 06:36:38.0
Scienscope International is excited to announce its first-ever appearance at a tradeshow in Canada. The company looks forward to discussing its array of innovative component solutions and advanced X-ray inspection systems at EPTECH Vancouver, scheduled for Wednesday, June 7, 2023. Scienscope will showcase its latest innovations at the event, including the AXC-800III X-ray component counter, IMS-100 (T) inventory management system, and the new Stencil Rack.
Industry News | 2015-07-20 07:36:12.0
SMTA/NPL Printing & Assembly Automatic Optical Inspection Experience is a special feature we are organising in Chicago this year and we are looking for Solder Paste Inspections SPI and Automatic Optical Inspection systems to test our specially produced boards. If you would like to show your technology contact us bobwillis@smta.org
Industry News | 2010-06-25 10:20:29.0
APS Novastar announces release of its new LS60V-LED Automated Pick and Place Machine specifically for LED placements applications.
With the DEK NeoHorizon iX you can’t go wrong. With their advanced features, the new models provide a powerful and highly accurate solution for any application.
