Full Site - : stencil for fine pitch 0.4mm (Page 3 of 12)

Essemtec Introduces Semi-automated Paste Printer Features for Vision System

Industry News | 2008-09-08 18:17:57.0

Essemtec's new stencil printer SP003-ML-V is a highly reliable system aimed at small and medium production volumes. Control of print quality and correction of print position is made easy and fast using the integrated vision system.

ESSEMTEC AG

DEK and PacTech Join Forces for High-Volume Wafer Bumping Solution

Industry News | 2003-06-13 10:10:58.0

By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.

ASM Assembly Systems (DEK)

Milara Receives Global Technology Award for Its Bumping System

Industry News | 2007-11-15 19:16:35.0

Medway, MA � November 15, 2007 � Milara Inc., a leading vendor of fully and semiautomatic stencil printers for SMT and semiconductor applications, announces that it has been awarded a Global Technology Award in the category of Wafer-level Products for its innovative AWPb 300.

Milara Inc

Christopher Associates Premiers Solder Pastes from Koki for ICT Performance and Fine-Pitch Printing

Industry News | 2009-12-14 20:45:09.0

December 2009 ? Christopher Associates, a pioneering supplier and distributor to the electronics and chemical processing industries, introduces two new solder pastes from Koki Company Ltd. (Tokyo, Japan).

Christopher Associates Inc.

ACD Purchases a VisionMaster 150 for Fast, Accurate Paste Analysis

Industry News | 2011-12-07 21:12:14.0

ACD announces the purchase of a VisionMaster 150 solder paste inspection (SPI) system. The VM150 will enable ACD to obtain 3-D color profiles for fast, accurate paste analysis.

Automated Circuit Design (ACD)

APS Novastar Introduces Automated Vision Control for L-Series Pick and Place Systems

Industry News | 2008-10-07 12:56:56.0

APS Novastar introduces automatic Vision Control for its L-Series pick and place systems. Vision Control advances the already precise, fast and reliable placement of 0201's with 100% accurate on-the-fly, bottom-up vision placement of micro BGA's and ultra fine pitch QFP's.

DDM Novastar Inc

APS Novastar Releases New Video on SMT Stencil Printers for PCB Assembly

Industry News | 2010-08-10 10:43:15.0

APS Novastar's new video provides an overview of its SPR line of Stencil Printers for printed circuit board (PCB) assembly and demonstrates the ease of product set up and use.

DDM Novastar Inc

Everett Charles Technologies Wins a 2008 NPI Award for Its Gemini Kelvin Spring Pins

Industry News | 2008-04-07 22:56:56.0

Pomona, CA - Everett Charles Technologies (ECT) Semiconductor Test Group (STG) announces that its Gemini Kelvin spring probe was awarded a NPI Award in the category of Test & Inspection � ICT. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.

Everett Charles Technologies

Seika offers a wide range of Sawa cleaners for quality assurance

Industry News | 2022-04-06 12:02:37.0

Seika Machinery, Inc. is pleased to offer a wide range of Sawa ultrasonic cleaners. From portable, manual stencil cleaners to fully automatic systems like the Sawa Ecobrid cleaner that can clean and dry in just six minutes, there is a solution for any cleaning application including removal of particulates from nozzles, squeegees, pallets, misprints and other parts.

Seika Machinery, Inc.

Kyzen Picks Up Its 45th Industry Award at APEX for New Stencil Cleaner

Industry News | 2014-03-26 18:33:44.0

Kyzen announces that it has been awarded a 2014 NPI Award in the category of Cleaning Materials for its AQUANOX® A8830 Low VOC Aqueous Stencil Cleaning Agent.

KYZEN Corporation


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