Full Site - : stencil for fine pitch 0.4mm (Page 5 of 12)

Heraeus Electronics showcases new portfolio for next-generation power electronics and semiconductor advanced packaging at SEMICON Korea 2023

Industry News | 2023-01-30 16:56:37.0

For the first time, Heraeus Electronics will exhibit at SEMICON Korea, scheduled to take place February 1-3, 2023, at COEX in Seoul, Korea. At the exhibition, Heraeus Electronics will show a wide range of innovative materials to enhance power modules and semiconductor device performance.

Heraeus

Study on Solder Joint Reliability of Fine Pitch CSP

Technical Library | 2015-12-31 15:19:28.0

Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.

Flex (Flextronics International)

Quad MV-100

Quad MV-100

Used SMT Equipment | Screen Printers

The MV-100 uses production-proven technology. It is fitted with sophisticated menu-driven control software for fast set-up and ease of use, making it one of the most user-friendly printers available. The tooling system is SMEMA compliant and will pro

Precision Placement Machines, Inc.

FINE LINE STENCIL Introduces New Laser Technology

Industry News | 2008-06-03 15:08:51.0

COLORADO SPRINGS, CO � June 3, 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces the availability of LPKF Laser Technology/SMT Stencil Laser Technology.

FCT ASSEMBLY, INC.

Essemtec to Exhibit at Mexitronica 2008

Industry News | 2008-10-07 21:01:46.0

ESSEMTEC, the leading manufacturer in Mexico of surface mount technology production equipment for mid volumes, announces that it will showcase several SMT production systems at the upcoming Mexitr�nica exhibition, scheduled to take place October 21-23, 2008, at the Expo Guadalajara, Hotel Hilton, in Guadalajara, Jalisco, M�xico.

ESSEMTEC AG

Essemtec Opens New Demo and Training Center in Suzhou, China

Industry News | 2008-09-30 22:07:25.0

Essemtec, the leading Swiss manufacturer of highly flexible production systems for electronics, announces that it has opened a new customer training center in Suzhou, China. Automatic and semiautomatic SMD production equipment is installed for demos, education and evaluation.

ESSEMTEC AG

MYDATA exhibits new MY200 pick-and-place machine at IPC APEX 2014.

Industry News | 2014-03-27 13:30:41.0

At APEX 2014 in Las Vegas, MYDATA will introduce to the North American market its new MY200 placement machine, delivering twice the accuracy and higher throughput.

Mycronic Technologies AB

ESSEMTEC exhibits precise semi-automatic printer SP150, Pantera XV and RO300FC-C at COMPONEX NEPCON 2009 in Delhi

Industry News | 2009-01-19 20:34:37.0

Essemtec, the leading manufacturer of surface mount technology production equipment, announces that it will highlight the printer SP150, the pick & place machine Pantera XV and the full convection oven RO300FC-C with RO-CONTROL software in hall no. 18, stand no. 338 at the upcoming COMPONEX NEPCON 2009 exhibition, scheduled to take place February 24-26, 2009, in Delhi, India.

ESSEMTEC AG

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited


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