Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej
Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio
Electronics Forum | Fri Dec 06 13:00:29 EST 2002 | daanterstegge
I wouldn't recommend a metal squeegee, because if you can't wipe the step-etched area completely clean (that's the problem with metal) you'll have problems with the definition of the fine-pitch (it may stick in the holes). Best is a 70 Shore polyuret
Electronics Forum | Sun Apr 14 14:13:25 EDT 2002 | davef
I assume you're looking at stencil fab equipment because you need 'faster turns' than you can get from available stencil suppliers. While you're assessing this, consider other alternatives, such as: * Dispensing paste. [A very funny SMTNetter, livin
Electronics Forum | Wed May 10 01:00:09 EDT 2000 | gary
0.65mm pitch QFP. I believe that this is the borderline for Fine Pitch. Will I have a good paste release with Chem-etch matched with a rubber squeegee? I'm planning of a 15% reduction on the Width and no reduction on the length. Any feedback whether
Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o
I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.
Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon
Maybe something like this could work?
Electronics Forum | Thu Nov 14 21:47:41 EST 2019 | sssamw
Yes, 0.25x0.25 square could work @0.1 thickness, use nano-coating or electroform stencil for better solder paste release.
Electronics Forum | Thu Nov 14 22:24:43 EST 2019 | dman97
Use a type 5 solder for maximum paste release.
Electronics Forum | Thu Nov 14 18:25:07 EST 2019 | myke03o
Hi Jandon, Thanks, I will try it on my DOE.
Electronics Forum | Mon Sep 20 20:51:36 EDT 1999 | Greg H.
My stencil thickness is 6 mil and we got qfp's with fine pitch. how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? thanks
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