Industry News | 2008-04-07 23:18:22.0
MORRISVILLE, NC - March 31, 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that its OPASS technology won a NPI Award in the Software category. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2008-04-08 23:53:03.0
MORRISVILLE, NC - April 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it won a 2008 SMT China Vision Award for its OPASS technology in the Software - Production category during an awards ceremony that took place April 8, 2008 at the Shanghai Everbright Convention & Exhibition International Hotel during NEPCON China/EMT China. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2013-11-15 16:37:31.0
In an independent global survey of SMT manufacturers*, MYDATA found that many of the classic production challenges facing low-volume, high-mix producers have now reached a "tipping point" for higher volume producers as well. The survey revealed that several key challenges are common to low-, mid- and high-volume producers: changeover efficiency, quality, line utilization, stock accuracy and reducing the cost per mounted component.
Industry News | 2008-09-16 11:54:15.0
Essemtec will exhibit the PANTERA-XV SMD placement system in booth907 at the upcoming IPC Midwest exhibition & conference, scheduled to take place September 24-25, 2008 in Schaumburg, IL.
Industry News | 2009-03-16 18:15:48.0
Essemtec will exhibit the PANTERA-XV SMD placement system in booth 2225 at the upcoming APEX 2009 exhibition and conference, scheduled to take place March 31-April 2, 2009, in Las Vegas.
Technical Library | 2008-03-18 12:36:31.0
This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required. The board contains standard SMD, chipset BGAs, connectors, through hole components and odd forms placed using full automation and soldered after two reflow cycles under critical process parameters. However, state of the art technology does not help if the process parameters are not set carefully. Can all complex BGAs, THTs and even screws be soldered on a single stencil? What will help us overcome bridging, insufficient solder and thombstoning issues? This paper will demonstrate the placement of all odd shape components using pin-in-paste stencil design and full completion of the motherboard after two reflow cycles.
Industry News | 2010-06-28 17:29:55.0
Expanding on its seven existing SMT lines, Reno, Nevada-based contract manufacturer EE Technologies (EET) recently added a state-of-the-art eighth assembly line specifically to showcase its unique approach to rapid prototype production. Having had a very positive experience with the DEK printers in its other seven lines, EET again choose DEK and has installed the company’s latest technology, a Horizon 03iX platform, to extend its rapid prototype capability.
Industry News | 2016-04-07 16:17:04.0
ASM Assembly Systems can look back on a very successful APEX 2016 trade show. The two lines being shown, one a high-speed line with the latest DEK NeoHorizon and SIPLACE TX modules and the other a high-mix line with super-flexible SIPLACE SX, attracted lots of visitors. The industry professionals were especially impressed that ASM already has concrete products for its Smart #1 SMT Factory concept in its portfolio, making it the leading technology partner for the future of electronics manufacturing. One of these products was the SIPLACE BulkFeeder, an innovative feeder module for high-volume production that trade publication Circuit Assembly immediately honored with its highly respective NPI Award. The SIPLACE BulkFeeder holds up to 1.5 million loose components and feeds them with exceptional precision – without tapes or splicing and the associated risks. The concept of the ASM ProcessExpert is equally revolutionary. With its integrated 5D SPM (solder paste management) system, the world's first inline expert systems controls and optimizes printing processes fully automatically. Another innovation was shown at the booth of ASM distributor Technica: With the E by SIPLACE, ASM addresses customers and applications in the mid-speed, small-lot and prototype manufacturing segments.
Industry News | 2016-12-26 13:40:59.0
SMT Step Stencils provide increased control over your print process. Vary thickness in any area of your stencil to generate the exact paste volume and height for every single component. A perfect solution for Pin-in-Paste applications. For FREE Technical Assistance please call (760) 798-6984
Industry News | 2012-08-15 10:30:35.0
LPKF Laser & Electronics will present a live webinar on September 4, 2012 at 11 a.m. PDT.
