Industry News | 2012-08-15 10:30:35.0
LPKF Laser & Electronics will present a live webinar on September 4, 2012 at 11 a.m. PDT.
Technical Library | 2014-12-24 19:22:52.0
For centuries, the squeegee blade has been used throughout many applications for depositing viscous materials through screens and stencils to transfer images on to substrates, from cloth material to electronic circuit boards. One area of blade printing mechanics that have been reviewed many times is the angle of attack of the blade. Typically it has been tested from 45 degrees to 60 degrees to optimize the printing quality and efficiency. However, this typically ends up as a compromise, from fill characteristics (45 degrees) to print definition (60 degrees). This paper will present the revolutionary performance of the profiled squeegee blade, which has recently been developed to create a virtual multi angle of attack for unsurpassed process control for all types of stencil printing processes.
Technical Library | 2009-01-21 23:16:14.0
This paper describes a new approach to drying circuit board assemblies that significantly reduces the cost of ownership of an aqueous cleaning system. Drying performance is increased through a hybrid drying process that reduces energy input, exhaust requirements and sound levels. The combination of high temperature blow-off and convection brings the flexibility to tailor drying performance to fit the product's drying requirements.
Industry News | 2008-09-08 18:17:57.0
Essemtec's new stencil printer SP003-ML-V is a highly reliable system aimed at small and medium production volumes. Control of print quality and correction of print position is made easy and fast using the integrated vision system.
Industry News | 2009-05-13 21:06:43.0
Medfield, MA � May 2009 � Milara Inc., a leading vendor of fully and semiautomatic stencil printers for SMT and wafer applications, announces the appointment of distributor PMR Representatives to cover Southern California and Baja, Mexico.
Industry News | 2011-06-07 16:27:10.0
Speedprint appoints Tool Technology Company as its manufacturers’ representative for the states of Missouri, Nebraska, Iowa and Kansas.
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Industry News | 2013-02-19 22:22:23.0
Speedprint Technology announces that it has been awarded a 2013 Circuits Assembly Service Excellence Award in the category of Screen / Stencil Printing for its outstanding customer ratings, as judged by its own customers.
Industry News | 2014-11-12 17:25:36.0
Speedprint Technology announces the appointment of Red Rock Reps as its manufacturers’ representative in the Western U.S. Chet Clark will represent Speedprint’s leading-edge stencil print technology throughout Colorado and Utah.
Industry News | 2024-03-11 17:57:27.0
StenTech® Inc. is proud to announce that it has been honored with a prestigious CIRCUITS ASSEMBLY 2024 NPI (New Product Introduction) Award in the category of Screen/Stencil Printing Peripherals/Consumables for its groundbreaking innovation - the StenTech BluPrint™ CVD (Chemical Vapor Deposited) Surface Treatment. Engineered to elevate Surface Mount Technology (SMT) processes, this advanced coating offers a comprehensive set of benefits that collectively contribute to improved stencil performance, longevity, and the overall quality of the SMT assembly process, streamlining production.