Electronics Forum | Thu Sep 24 19:54:40 EDT 1998 | S. Evers
| I am looking for anyone out there that has had experience with stenciling with chipbonder adhesives. I need information on material and stencil design. The firm who can help is K&J marketing their new KEPOCH stencil material is a (plastic) polyimi
Electronics Forum | Fri Sep 25 12:53:25 EDT 1998 | Bill Schreiber
Regarding cleaning Chipbonder adhesives from stencils and misprinted PCBs. Check out the Smart Sonic Stencil Cleaning Process at: www.smartsonic.com | | I am looking for anyone out there that has had experience with stenciling with chipbonder adhe
Electronics Forum | Tue Feb 25 11:56:33 EST 2020 | slthomas
I think I'd opt for a stencil with everything already cut and then tape it if that didn't screw up your stencil gasketing. Then you just have to define the process for adding the optional parts and you can decide to use those apertures or not.
Electronics Forum | Wed Sep 18 19:43:12 EDT 2002 | dragonslayr
One more variable I've remembered - pad height with respect to solder mask height. Pads being too low can cause stencil "gasketing" problems that in turn allow more paste to be deposited than needed. Are your fabs HASL or some other media?
Electronics Forum | Thu Jun 15 09:58:12 EDT 2006 | slthomas
Just to add to what dave said, the only limitation to how frequently you clean is the cost of the cleaning medium. You can wipe every board if you want to, but you'll go through material accordingly. If you're printing 16mil pitch or smaller, cleani
Electronics Forum | Wed Sep 21 15:49:45 EDT 2022 | markhoch
I agree. The silkscreen will cause a gasketing issue with the stencil.
Electronics Forum | Mon Aug 23 14:09:56 EDT 2010 | davef
Similar to Coop's comments, above ... Bridging: * Mis-placement: misplaced components, high placement force mushrooms paste * Too much paste: HASL thickness, lead finish, poor underside support, poor underside wipe frequency, printing with too lar
Electronics Forum | Tue Feb 21 09:19:50 EST 2006 | Chunks
Hi Mark, Not to be condescending, but is your 265 camera in focus? I've seen one instance of this. If it�s not the camera, and you are sure all your other parameters are good, , then poor definition can be from bad snap-off or bad gasketing. Snap
Electronics Forum | Thu Jun 29 10:38:04 EDT 2000 | John Thorup
Hello Christopher I don't know if there is any kind of official standard but I can tell you that the HADCO DFM manual specifies a nominal thickness of 50-1500u" with an option for 100-1000u" and the Merix DFM manual specifies 30-200u" Our boards (fro
Electronics Forum | Wed Feb 07 06:37:39 EST 2007 | mk
We have been processing a family of boards for 3 years. No issues. New PCB Vendor and the boards suddenly will not print very well. Sloppy printing definition. Closer inspection reveals that the soldermask is built up .0012-.0019 over the vias, preve
