Industry News | 2020-06-11 05:50:07.0
Seika Machinery, Inc. announces a special summer sale on select products. Significant savings are available for McDry cabinets, Sawa stencil cleaners, Sayaka PCB routers, Malcom viscometers, paste mixers and profiler systems while stock lasts.
Technical Library | 2018-09-26 20:33:26.0
Bottom terminated components, or BTCs, have been rapidly incorporated into PCB designs because of their low cost, small footprint and overall reliability. The combination of leadless terminations with underside ground/thermal pads have presented a multitude of challenges to PCB assemblers, including tilting, poor solder fillet formation, difficult inspection and – most notably – center pad voiding. Voids in large SMT solder joints can be difficult to predict and control due to the variety of input variables that can influence their formation. Solder paste chemistries, PCB final finishes, and reflow profiles and atmospheres have all been scrutinized, and their effects well documented. Additionally, many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. This study focuses on I/O pad stencil modifications rather than center pad modifications. It shows a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.
Industry News | 2015-10-05 18:14:25.0
Several Indium Corporation experts will share their knowledge and expertise at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26-29, in Orlando, Fla.
Technical Library | 2023-05-02 18:50:24.0
Surface-mount PCB components are smaller than their lead-based counterparts and provide a radically higher component density. They are available in a variety of shapes and sizes designated by a series of standardized codes curated by the electronics industry. Of these PCB components, the 0201-sized are the smallest, measuring 0.024 x 0.012 in. (0.6 x 0.3 mm) – that's 70% smaller than the previous 0402 level! The 0201 components are designed to improve reliability in space-constrained applications such as portable electronics like smartphones, tablets, robotics and digital cameras, but require delicate handling during the assembly process. Given the miniaturized dimensions of an 0201 package, it is crucial that the mounting process abide by a series of guidelines regarding the design of the PCB mounting pads and solderable metallization, PCB circuit trace width, solder paste selection, package placement and overages, solder paste reflow, solder stencil screening, and final inspection. It's advisable that one review this information when procuring the services of a PCB assembler.
Industry News | 2001-05-21 13:24:29.0
Uses less chemistry, generates less wastewater and cleans solder paste, adhesives and flux residue in one system!
Industry News | 2014-02-21 12:50:41.0
Kyzen today announced that Mike Bixenman, DBA, CTO, and David Lober will present at five separate technical sessions at IPC APEX EXPO in Las Vegas in March.
Industry News | 2010-01-22 20:48:32.0
GREELEY, CO —FCT Assembly announces that it has received a certificate of registration for the International Standard ISO 9001:2008. This prestigious certificate is an essential requirement in the Precision Parts, Solder and Stencil Manufacturing markets.
Career Center | Auckland, New Zealand | Engineering
NAVMAN PCBA NPI Engineer Reporting To: PCBA NPI Technical Leader Primary Objective: Transition of PCBs from R&D design to a manufacturable state conforming to all facets of PCBA production Secondary: Develop DFM & best practice guidelines Res
Career Center | Newbury Park, California USA | Engineering,Maintenance,Production,Quality Control
MUST BE: Proficient with Stencil Print Operations. Familiarity with SMT component types and packages. Ability to read and understand procedure document and work instructions. Operate fully automated SMT, Surface Mount Lines including: Screen Pr
Industry News | 2011-08-24 14:41:54.0
Kyzen announces that Dr. Mike Bixenman will teach a Professional Development Course on the IPC-CH-65B Guidelines for Cleaning of Printed Boards and Assemblies at the upcoming IPC Midwest Conference & Exhibition, scheduled to take place September 21-22, 2011 at the Renaissance Schaumburg Hotel and Convention Center in Schaumburg, IL.
