Industry Directory | Manufacturer / Manufacturer's Representative
We are the ex-clusive representatives of Philips SMT equipment in india. We also have tie-ups with several other supliers for devising a complete line solution
Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
2,0 Cpk @ ±17,5 μmDemision:1300mm×1000mm×1600mmProduct description: ASM DEK TQ SMT Stencil Printer, Max PCB: 400x400 mm, Core cycle time：5 secs, Demision:1300mm×1000mm×1600mm, Wet print capability > 2,0 Cpk @ ±17,5 μm ASM DEK TQ SMT Stencil Prin
New Equipment | Assembly Services
Hanwha HM520 SMT Assembly Line Hanwha HM520 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 80000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place ma
Electronics Forum | Wed Sep 07 03:03:35 EDT 2005 | Milroy
I am engaged with SMT production and we are going to have a brand new SMT line and I am studing about the screen printing and I have seen most commonly used stencil thickness is 6mil and I need to know what is the best solder paste height we can achi
Electronics Forum | Thu Sep 08 03:40:59 EDT 2005 | GS
do not forget also wich Type of paste used( granulometry) if Type-3 ? Type 4? etc, it could change in final metal on your pads/joints. Regards GS
Used SMT Equipment | Screen Printers
Very nice MPM UP2000 Stencil Printer For Sale. Machine is ready and run!! See attached pictures and information below. Equipment Description •MPM UP2000 Stencil Printer •Type: In-Line Fully Automatic •Model Number: UP2000/B •Serial Number: 22566
Used SMT Equipment | Screen Printers
Very Nice Printek II Semi Automatic Stencil Printer For Sale Serial Number: 4262012 2 Camera Stencil Alignment Shuttle Table from Left to Right Set Squeegee Pressure / Speed Height Includes Squeegee Holders and Blades in Pictures 110 Volt
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Parts & Supplies | SMT Equipment
The entire set of components measuring blade Name: 990314 MPM stencil measuring height; scraper height of the entire set of measured components; including cylinders, motors, contact switch Part Number: 990314 MPM stencil measuring height; scraper
Parts & Supplies | Screen Printers
Part Number: 1002440 Applicable models: MPM AP; UP2000; UP2000HIE Side height motor Tactile motor; 1002440, new spot Tactile part MPM AP UP2000 1002440 MPM stencil height measured motor; MPM height measured motor scraper MPM AP UP2000 CA8
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Hello and thank you for your interest in our MPM UP2000 Hie Stencil Printer For Sale. The machine was recently taken out of an SMT Manufacturing facility which closed. It is located at our facility where it was powered up, cycled, and zero reset by a
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
Career Center | brampton, Ontario Canada | Engineering,Management,Production,Technical Support
- More than 14 years of experience in set-up, calibrate, program, troubleshoot SMT machines and SMT process, for the manufacturing of PCB Electronic Assemblies - 5 year experience in leading position for electronic manufacturing/Process Engineering.
SMTnet Express, April 16, 2015, Subscribers: 22,628, Members: Companies: 14,302, Users: 38,055 Stereo Vision Based Automated Solder Ball Height Detection Jinjin Li, Lina J. Karam; School of Electrical, Computer, & Energy Engineering, Arizona State
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
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Semi-auto SMT Solder Paste Stencil Printer from China manufacturer - Dongguan Intercontinental Technology Co.,Ltd. English Français Pусский Español Português Deutsch Italiano 日本語 한국어 Tiếng Việt Türk dili Home About Us Company Profile
