Industry News | 2011-07-13 15:26:19.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit its lead-free SN100C-XF3+ solder paste and wire at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled to take place Thursday, July 14, 2011 at the Doubletree Hotel in Cleveland, OH.
Industry News | 2011-08-22 20:06:30.0
Cobar Solder Products will exhibit its lead-free SN100C-XF3+ solder paste and wire in Booth #407 at the upcoming IPC Midwest Conference & Exhibition
Industry News | 2012-06-01 09:27:11.0
The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit its lead-free SN100C-XF3+ solder paste and wire at the upcoming SMTA Upper Midwest Expo & Tech Forum,
Industry News | 2015-09-28 10:29:02.0
Introducing LOCTITE GC 3W – The first ever water soluble / water wash temperature stable solder paste.
Industry Directory | Manufacturer
Speedprint Technology is an award-winning company delivering comprehensive printing solutions with a focus on value, flexibility and low cost-of-ownership for the SMT and Semiconductor industries.
We are VONSQUARE the start of a Smart Factory. VONSQUARE provides the standard infrastructure for SMT (Surface Mount Technology). By providing our customers with better solutions through our technology and know-how based on our experience, we are d
Industry News | 2008-07-30 20:42:23.0
GREELEY, CO � July 30, 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.'s SN100C product line, premiers WS170 water soluble solder paste.
Industry News | 2010-03-22 13:59:02.0
GREELEY, CO — FCT Assembly introduces its NL932 no-clean, lead-free, halide-free solder paste. The paste features excellent solderability, enabling the process to handle the most difficult wetting requirements.
Industry News | 2004-10-15 16:35:07.0
To meet the high demand of water-soluble solder paste users who need to comply with the Pb-Free requirements, Indium Corporation of America has developed the next generation of Pb-Free Solder Paste, Indium3.1.
Industry News | 2015-01-19 20:59:27.0
FCT Assembly today announced that it will present a new process for evaluating solder pastes in Booth #713 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Field application engineer, Tony Lentz, also will present the paper written on the new evaulation process titled “Dispelling the Black Magic of Solder Paste.” The presentation will be held during the Fluxes Technical Conference Session on Tuesday, Feb. 24 from 1:30-3 p.m.
