Full Site - : stencil vs pad design (Page 11 of 117)

Fill the Void II: An Investigation into Methods of Reducing Voiding

Technical Library | 2018-10-03 20:41:44.0

Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you, there are many excellent ways to "Fill the Void." This paper is a continuation of previous work on voiding in which the following variables were studied: water soluble lead-free solder pastes, a variety of stencil designs, and reflow profiles. Quad Flat No-Lead (QFN) component thermal pads were used as the test vehicle. The voiding results were summarized and recommendations were made for reduction of voiding.

FCT ASSEMBLY, INC.

Permalex Edge®  SMT Printing Metal Squeegee Blades

Permalex Edge® SMT Printing Metal Squeegee Blades

New Equipment | Printing

Maximize Your Micro-Electronics Printing Results Transition's patented Universal Holder design gives you outstanding functionality, ergonomics and choices that enable you to achieve greater performance and profitability on your SMT line. Permalex E

Transition Automation, Inc.

HawkEye®  - High Speed Deposit Verification System

HawkEye® - High Speed Deposit Verification System

New Equipment | Printing

HawkEye is an automatic print verification technology that operates at the line beat rate. The system can be configured to assess 100% of printed boards and gives a rapid go/no-go indication for each, meaning that faulty boards can now be automatical

ASM Assembly Systems (DEK)

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:14:11.0

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Flason Electronic Co.,limited

InspectScan VPI - Virtual Product inspection System

InspectScan VPI - Virtual Product inspection System

New Equipment | Inspection

InspectScan VPI is a fully integrated, stand-alone process control, measurement and inspection and programming workstation for use in setting up processes before the production floor in the PCB or Hybrid Microcircuit assembly industries. InspectScan

Smart Sonic Stencil Cleaning Systems

Semi-auto solder past printing machine

Semi-auto solder past printing machine

New Equipment | Soldering - Other

Function: Semi-automatic solder paste printing machine is an equipment to use on SMT production, working principle is to using the stencil to print the solder paste on the specified pad, the good or bad solder paste printing, directly affect the fin

Shenzhen WIT Technology CO.,LTD

MICRONOX MX2100 Aqueous Cleaner For Power Module Devices

MICRONOX MX2100 Aqueous Cleaner For Power Module Devices

New Equipment | Cleaning Agents

MICRONOX MX2100 is an aqueous, single-phase solvent designed to remove tough flux residue from PMIC devices including IGBT modules and power MOSFETs. MX2100 has a well-balanced formula that provides outstanding cleaning performance and metal compatib

Southwest Systems Technology

The Design Principles of Stencil Apertures

Industry News | 2018-10-18 10:24:05.0

The Design Principles of Stencil Apertures

Flason Electronic Co.,limited

JUKI RX-6 High Speed Compact Modular Mounter

JUKI RX-6 High Speed Compact Modular Mounter

New Equipment | Pick & Place

Brand new modular mounter RX-6 combines high productivity, high flexibility and high quality using non-stop vision recognition and meets the demands of a wide range of components and boards. Its replaceable head allows you to configure a production

Juki Automation Systems

Time & Money Saved with New 'HD' Stencil Material

Industry News | 2002-07-23 03:19:20.0

Datum Alloys (suppliers of specialist alloys) Has Found The Solution To High Density & Ball Grid Array Stencils

Datum Alloys Ltd


stencil vs pad design searches for Companies, Equipment, Machines, Suppliers & Information