Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
HawkEye is an automatic print verification technology that operates at the line beat rate. The system can be configured to assess 100% of printed boards and gives a rapid go/no-go indication for each, meaning that faulty boards can now be automatical
Maximize Your Micro-Electronics Printing Results Transition's patented Universal Holder design gives you outstanding functionality, ergonomics and choices that enable you to achieve greater performance and profitability on your SMT line. Permalex E
Technical Library | 2018-10-03 20:41:44.0
Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you, there are many excellent ways to "Fill the Void." This paper is a continuation of previous work on voiding in which the following variables were studied: water soluble lead-free solder pastes, a variety of stencil designs, and reflow profiles. Quad Flat No-Lead (QFN) component thermal pads were used as the test vehicle. The voiding results were summarized and recommendations were made for reduction of voiding.
Industry News | 2018-10-18 08:44:36.0
Lead-free Reflow Profile: Soaking type vs. Slumping type
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2018-10-18 10:24:05.0
The Design Principles of Stencil Apertures
New Equipment | Education/Training
Bob Willis has an extensive range of training videos available online. The complete video collection is available to view online for a fixed fee, based on a six month period. After purchase you are provided with links to each of the online videos for
Industry News | 2002-07-23 03:19:20.0
Datum Alloys (suppliers of specialist alloys) Has Found The Solution To High Density & Ball Grid Array Stencils
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
