Electronics Forum | Mon Apr 21 14:43:05 EDT 2014 | emeto
To your first question - Yes you have to take out your paste and leave it on room temperature to warm up(my paste requires 8hours by manufacturer). Second question: If you have controlled room temperature and: If you use jar - up to 5 days your past
Electronics Forum | Wed Aug 03 07:29:03 EDT 2022 | pradeep14
Hi, We are facing the issue with Component orientation(Wrong orientation), during Proto build/NPI time in SMT for 1st board placement. We are not doing 1st board with STICKY board, directly placing the components with Paste board only. Pls suggest, H
Electronics Forum | Thu Jan 31 09:23:50 EST 2008 | realchunks
I agree with Sr. and Doug. Capable equipment will run like sh^t if the process is not in control. Number one, don't be scard of BGAs. They are pretty easy if done in control and will cause you less pain than you ever thought. X-Ray is your best i
Electronics Forum | Mon Jul 30 02:01:15 EDT 2001 | mugen
Hey....sneaky smartie here.... my finance manager, would love to have you on the MRB team.... Anyway, most technical paste specs, do highlight the possibility, should the paste become "dry" or "sticky", we MAY recondition the paste, by "place it fro
Electronics Forum | Thu Jun 22 19:43:05 EDT 2006 | davef
We hope this meets your standards for acceptable responses. * http://www.uic.com/wcms/images2.nsf/(GraphicLib)/Time_Pressure_Dispensing.PDF/$File/Time_Pressure_Dispensing.PDF * On the Flow Rate Dynamics in Time-Pressure Dispensing Processes; X. B. C
Electronics Forum | Thu Aug 05 19:10:53 EDT 2004 | celldude
wash->ssd top->wash->sticky flux bottom side->place smt components->reflow->wash->sticky flux top side->place topside smt components->reflow->wash) ssd is basically the process of applying solder paste to the pcb with a stencil and the solder reflowe
Electronics Forum | Mon Sep 20 17:26:22 EDT 1999 | Earl Moon
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Tue Jun 30 12:08:55 EDT 2009 | wrongway
sipad does work we used it on one assy it had a very fine pitch part on it and at that time our dek 260 wasn't up to the task along with our 8 mil stencils. we had no problems with it it was sticky enough to hold the parts on thur all smt machines.
Electronics Forum | Mon Oct 08 14:52:13 EDT 2018 | emeto
+paste was not stored properly Paste doesn't have enough flux and is more sticky than usual. Could be a lot code related or a purchase order related. I wold order a new jar and try immediately.
Electronics Forum | Thu Mar 16 10:19:15 EST 2006 | slthomas
Is it possible that the other facility you were at was running a WS paste more or exclusively? We found that the nc Kester left us with a lot more sticky mess than the ws. That said, are you sure you're also getting enough exhaust airflow?
