Electronics Forum | Fri Jun 14 14:25:05 EDT 2002 | davef
Good job clarifying things. So, your MELF are just rolling off the pads. So much for the rocket scientist that talked you into those �V� shaped apertures, eh? [Or taking it the other way: Wow, just think how bad it would be if they weren�t worki
Electronics Forum | Wed Sep 22 21:23:03 EDT 1999 | se
| | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | The stencil is 6 mil thick, laser cut and electo-polished. | | The apertures are 12 mil in diameter with 20 mil pitch. | | We
Electronics Forum | Thu Sep 23 12:47:48 EDT 1999 | Earl Moon
| | | I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | | | The stencil is 6 mil thick, laser cut and electo-polished. | | | The apertures are 12 mil in diameter with 20 mil pitch.
Electronics Forum | Sat Sep 07 06:57:33 EDT 2002 | mk
I agree but, are there really heavy metals in this water? Our process is as follows. Print Paste Reflow Board (no components, water soluble paste only) Wash Board Same reflow profile for almost every order so no solder balling issues etc. Carbon an
Electronics Forum | Sun Dec 11 08:13:27 EST 2005 | stepheniii
If you are taking off the old BGA then the board finish is not the same as it was orginally. I would want to clean the pads off as much as possible and then use sticky flux with the new BGA. But on the other hand, Aim solder has an article about smal
Electronics Forum | Wed Oct 19 13:07:04 EDT 2016 | cyber_wolf
Are there indentations in the paste ? If there is, you have a couple things to look at off the top of my head:1) make sure your spool valves are shutting completely off. 2) make sure there is nothing sticky on your nozzles.3) Adjust the blow off/ "ki
Electronics Forum | Sat Jun 02 08:47:25 EDT 2007 | mika
I almost forgot; If the pcb have HASL (Non RoHS) surface finish, then big fine pitch QFP:s could be shifted during reflow, beacuse of the un-even pad-surface... We have been trough that scenario also... But step No.1 is to make sure that the componen
Electronics Forum | Wed Oct 17 19:01:34 EDT 2001 | scott
We have a local shop here in S-Cal. called MaskTek that invented a solder deposition process that eliminates the need for solderpaste but you still need to use "sticky" flux. They license the process to various facilities around the country. Was pr
Electronics Forum | Sat Aug 07 17:27:00 EDT 2004 | celldude
We use ssd on all components, from 0201 to very large fine pitch and bga's. With some very small micro bga's , if there is a problem with bridging, we will tape off the stencil during the ssd process and just use bare pads...along with the solder fr
Electronics Forum | Thu Mar 16 15:03:35 EST 2006 | slthomas
The right way is to know what velocity numbers would net you the required flow for your oven and then measure with a manometer. The required velocity is primarily a function of pipe diameter (and blower rpms) but length and how bendy it is contribute
