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gas to extend allowed print-to-place time?

Electronics Forum | Thu Apr 21 19:41:35 EDT 2016 | adamjs

Hi, is there some sort of gas (certainly refrigerated, possibly pressurized?) in which printed boards can be stored to extend the allowed time between SMT paste printing and placement? Or other technique for achieving this? Background: we're a smal

Re: Missing SMT Chip Components

Electronics Forum | Mon Sep 13 21:18:29 EDT 1999 | Dave F

| Hi, | | Recently encountered missing components problem at the SMT process. | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked t

Re: solder mask

Electronics Forum | Mon Aug 09 16:15:30 EDT 1999 | JohnW

| I am having cleaning problems when processing PCB's which have | TAIYO solder mask on them. After processing, hand soldering and | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide marks etc. Other soldermasks

Re: solder mask

Electronics Forum | Tue Aug 10 07:28:49 EDT 1999 | Brian

| | | I am having cleaning problems when processing PCB's which have | | | TAIYO solder mask on them. After processing, hand soldering and | | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide marks etc. Other

Re: solder mask

Electronics Forum | Tue Aug 10 15:19:55 EDT 1999 | Earl Moon

| | | | I am having cleaning problems when processing PCB's which have | | | | TAIYO solder mask on them. After processing, hand soldering and | | | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide marks etc.

Re: solder mask

Electronics Forum | Tue Aug 10 15:47:34 EDT 1999 | John Thorup

| | | | | I am having cleaning problems when processing PCB's which have | | | | | TAIYO solder mask on them. After processing, hand soldering and | | | | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tide mark

Re: solder mask

Electronics Forum | Tue Aug 10 16:01:12 EDT 1999 | Earl Moon

| | | | | | I am having cleaning problems when processing PCB's which have | | | | | | TAIYO solder mask on them. After processing, hand soldering and | | | | | | cleaning, a sticky residue is remains, resulting in a cosmetically poor finish with tid

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: BGA collapse during reflow

Electronics Forum | Wed Jul 14 14:05:52 EDT 1999 | KT

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

672 PBGA on PC Card .015 thick pcb

Electronics Forum | Thu Oct 11 17:44:30 EDT 2001 | aaelect

OK, OK. 672 ball BGA. The pcbs are PC Card bus size and are .015 thick. There are 3 on a panel with about 1/2" between and rails. The aluminum plates are about 3" by 7". There are 3 cutouts which allow for the parts from either side to protrude du


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