Electronics Forum | Tue Oct 31 13:15:13 EST 2006 | realchunks
SWAG is prolly right. You can verify the tactile sensor by watching the machine carefully. When finding the stencil height, make sure the board goes all the way up and touches the stencil to trigger the tactile. If it doesn't, then something is wr
Electronics Forum | Tue Sep 14 21:56:34 EDT 1999 | KEVIN SIMPSON
| | Hi, | | | | Recently encountered missing components problem at the SMT process. | | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. C
Electronics Forum | Sat Jun 12 10:46:32 EDT 1999 | Dean
| Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manufac
Electronics Forum | Sat Jun 12 16:33:52 EDT 1999 | JohnW
| | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down from manuf
Electronics Forum | Mon Jul 12 10:21:06 EDT 1999 | Earl Moon
| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye
Electronics Forum | Thu Sep 30 03:37:26 EDT 1999 | Brian
| We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control an
Electronics Forum | Fri Oct 01 00:18:18 EDT 1999 | Earl Moon
| | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process control
Electronics Forum | Fri Oct 01 09:03:25 EDT 1999 | Dave F
| | | We are all faced with increasing interconnect density in all we do. This means smaller everything, especially components and that which they are mounted upon but, hopefully, without smaller minds and thoughts. It all demands more process contro
Electronics Forum | Wed Sep 15 03:11:33 EDT 1999 | Charles Stringer
| | | Hi, | | | | | | Recently encountered missing components problem at the SMT process. | | | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post r
Electronics Forum | Thu Jun 17 11:18:03 EDT 1999 | Ian Clelland
| | | | | | Our company is experiencing cracked caps at our pick and place operations. The caps are being placed onto epoxy dots for subsequent wave solder operations. At present, be have set the pressure of the head at 2 in/lbs. This being down fr
