Full Site - : storing silver plated copper wire (Page 1 of 10)

KappAloy15 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

KappAloy15 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

New Equipment | Solder Materials

KappAloy15™ - 85%Sn - 15%Zn – has a wider plastic range of 390°F - 500°F (199°C - 260°C). This makes it ideal for hand soldering Aluminum plates and parts, allowing manipulation of the parts as the solder cools. KappAloy™ Tin-Zinc solder is designe

Kapp Alloy & Wire, Inc

Metal Base PCB

Metal Base PCB

New Equipment | Fabrication Services

Based on the special application of PCB, Aluminum base material and Copper base material are used to replace the traditional FR-4 material. Eastech has very mature production and manufacturing experience for PCB based on metal materials. We always br

Eastech Group Circuit Technology (ShenZhen) CO., LTD

TipSave N Flux-Cored Solder Wire

TipSave N Flux-Cored Solder Wire

New Equipment | Solder Materials

A new silver-free and lead-free solder alloy is now available from Nihon Superior. It reduces the wear rate of soldering tips. It is a new alloy developed to reduce soldering tip wear. It can achieve an improvement of about threefold compared to SAC3

Nihon Superior Co., Ltd.

Factors That Influence Side-Wetting Performance on IC Terminals

Technical Library | 2023-08-04 15:27:30.0

A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.

Texas Instruments

Factors That Influence Side-Wetting Performance on IC Terminals

Technical Library | 2024-04-08 15:46:36.0

A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.

Texas Instruments

Dow Electronic Materials to Showcase Leading Materials for Printed Circuit Board Manufacturing at the IPC APEX EXPO

Industry News | 2011-04-06 13:13:52.0

Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.

Dow Electronic Materials

Saelig Introduces Quick-Setup -100dB Attenuation RF/EMI Tabletop Enclosures

Industry News | 2020-05-28 10:52:31.0

SFI High Attenuation Frameless Enclosures are compact, easy to setup and tear down, and offer excellent EMI isolation on the benchtop

Saelig Co. Inc.

New Yorker Electronics Unveils New CIT Relay & Switch Process Sealed Snap-Action Switches

Industry News | 2021-03-03 14:17:42.0

New CIT Relay & Switch IP67 Process Sealed VM3S Series Snap-Action Switch Protects Against Environmental Distress

New Yorker Electronics

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Nihon Superior to Exhibit TipSave N at APEX 2020

Industry News | 2020-01-06 16:02:00.0

Nihon Superior Co. Ltd. is pleased to announce plans to showcase its new TipSave N flux-cored solder wire in Booth #2043 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The company also will exhibit SN100CV P608 D5 solder paste.

Nihon Superior Co., Ltd.


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