Industry Directory | Consultant / Service Provider / Training Provider
ERI is a specialized engineering school, focusing on the reliability and durability of hardware, upon the kinds of stresses that can shorten the life of hardware such as yours and upon appropriate tests to uncover weaknesses.
Career Center | San Jose, California USA | Engineering
Associate Mechanical Engineer The main role of the Associate Mechanical Engineer will be to design, develop, and build apparatuses and fixtures, which purpose will be to test and control our clients' manufacturing output. Each of these apparatuses a
Industry Directory | Manufacturer
Manufacturers of high quality Reed Relays for Instrumentation and Automatic Test Equipment (ATE), High voltage switching, Low thermal EMF, Direct drive from CMOS, RF switching and other specialist applications.
Industry News | 2018-01-31 07:56:57.0
Seika Machinery today announced plans to introduce the new KYOWA ELECTRONIC INSTRUMENTS CO., LTD. PCAS-1000A Stress Measurement Kit. Company representatives will show the kit for the first time in Booth #2043 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca.
Career Center | San Jose, Nationwide | Engineering,Management
This world-renowned $13B organization is seeking a Product Reliability Engineering Manager (to report directly into the VP) for our San Jose, CA corporate technology office. We prefer candidates in the Silicon Valley area, but will consider candidat
Our new test facility provides: EMI testing and regulatory approvals Product Safety testing and regulatory approvals NEBS and ETSI testing Temperature/Humidity testing Vibration testing Airflow testing Acoustic testing Thermal imaging Shipp
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Industry Directory | Consultant / Service Provider
Tebo ICT ATE FCT MDA test fixture Probe GC-PowerStation Testway Unisoft valor Trilogy-5000 UGS-Tecnomatix ODBinside Cadence CAMCAD IDF4.0 ECAD Strain-Gauge FEA BSA Board-Stress-Analysis CircuitWor
Technical Library | 2009-11-05 11:17:32.0
Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint with enough of a connection to have electrical integrity, but lacking sufficient mechanical strength. Due to the lack of solder joint strength, these components may fail with very little mechanical or thermal stress. This potentially costly defect is not usually detected in functional testing, and only shows up as a failure in the field after the assembly has been exposed to some physical or thermal stress.
Technical Library | 2015-05-21 18:46:31.0
In this work the reliability of an embedded planar capacitor laminate under temperature and voltage stress is investigated. The capacitor laminate consisted of an epoxy-BaTiO3 composite sandwiched between two layers of copper. The test vehicle with the embedded capacitors was subjected to a temperature of 125oC and a voltage bias of 200 V for 1000 hours. Capacitance, dissipation factor, and insulation resistance were monitored in-situ. Failed capacitors exhibited a sharp drop in insulation resistance, indicating avalanche breakdown. The decrease in the capacitance after 1000 hours was no more than 8% for any of the devices monitored. The decrease in the capacitance was attributed to delamination in the embedded capacitor laminate and an increase in the spacing between the copper layers.
