Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 4156C Precision Semiconductor Parameter Analyzer Agilent 4156C Precision Semiconductor Parameter Analyzer Bench top solution for advanced device characterization. The superior low-current and low-voltage resolution and built-in
Used SMT Equipment | In-Circuit Testers
Agilent-Keysight 4156C Precision Semiconductor Parameter Analyzer Agilent 4156C Precision Semiconductor Parameter Analyzer Bench top solution for advanced device characterization. The superior low-current and low-voltage resolution and built-in
Industry News | 2013-11-08 17:55:20.0
Several Indium Corporation technology experts will present at the inaugural IPC Conference on Solder and Reliability November 13-14 in Costa Mesa, California.
Nanovea offers clients worldwide to an unmatched range of Nano, Micro & Macro Mechanical, Metallurgy, Tribology and 3D Non-Contact or AFM materials characterization. Measurements include: Scratch Adhesion, Indentation Hardness, Wear Friction, Elastic
Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Industry News | 2001-08-28 18:23:19.0
Coming up on October 9!
Industry News | 2001-08-28 18:25:48.0
Coming up on October 1!
Technical Library | 2019-12-26 19:13:52.0
Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration.In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB.
