Technical Library | 2018-08-15 17:27:28.0
Smartphones and tablets require very high flexibility and severe bending performance ability of the flexible printed circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs, the extraordinary highly flexible, treated rolled-annealed (RA) copper foils have recently used instead of regular RA foil and electro deposited foils. It is very important to measure the Young's moduli of these foils predicting the mechanical properties of FPCs such as capabilities of fatigue endurance, folding, and so on. Even though the manufacturers use IPC TM-650 2.4.18.3 test method for measuring Young's modulus of copper foils over many years, where Young's modulus is calculated from the stress–strain (S–S) curve, it is quite difficult to obtain the accurate Young's modulus of metal foils by this test method.
Technical Library | 2022-09-25 20:18:33.0
Printed circuit board (PCB) bending and/or flexing is an unavoidable phenomenon that is known to exist and is easily encountered during electronic board assembly processes. PCB bending and/or flexing is the fundamental source of tensile stress induced on the electronic components on the board assembly. For more brittle components, like ceramic-based electronic components, micro-cracks can be induced, which can eventually lead to a fatal failure of the components. For this reason, many standards organizations throughout the world specify the methods under which electronic board assemblies must be tested to ensure their robustness, sometimes as a pre-condition to more rigorous environmental tests such as thermal cycling or thermal shock.
Industry News | 2013-05-02 10:42:04.0
Multitest, announces that its ecoAmp™ high-power Kelvin contactor successfully passed a challenging evaluation for an automotive application at an European-based IDM.
Industry News | 2020-11-06 04:01:25.0
Temperature humidity test chambers replicate both the humidity and temperature of the environment. Humidity readings at intense temperatures signal to testers how they react to cold, hot, humid, and arid conditions in various mixes. Controlling humidity is hard without maintaining temperatures.
Industry News | 2012-05-03 10:52:27.0
Multitest announces the debut of its latest Kelvin contactor — a state-of-the-art solution for high-power applications of 500+ Amperes.
Technical Library | 2022-10-31 17:30:40.0
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive, but non-exhaustive, collection of thermal cycling test results. The assembled database covers life test results under multiple test conditions and for a variety of components: conventional SMT (LCCCs, resistors), Ball Grid Arrays, Chip Scale Packages (CSPs), wafer-level CSPs, and flip-chip assemblies with and without underfill. First-order life correlations are developed for SAC assemblies under thermal cycling conditions. The results of this analysis are put in perspective with the correlation of life test results for SnPb control assemblies. Fatigue life correlations show different slopes for SAC versus SnPb assemblies, suggesting opposite reliability trends under low or high stress conditions. The paper also presents an analysis of the effect of Pb contamination and board finish on lead-free solder joint reliability. Last, test data are presented to compare the life of mixed solder assemblies to that of standard SnPb assemblies for a wide variety of area-array components. The trend analysis compares the life of area-array assemblies with: 1) SAC balls and SAC or SnPb paste; 2) SnPb balls assembled with SAC or SnPb paste.
New Equipment | Test Equipment
This product is NEW USD $6960.00 Megger BITE 2 Megger Model # BITE 2 Catalog # 246002B Battery Impedance Test Equipment Determines condition of lead-acid and NiCd cells up to 7000 Ah On-board Pass/Warning/Fail indications Robust,
Industry News | 2002-05-16 16:53:54.0
New Family of 12 Automated Accelerated Reliability Test Systems (AARTS) Starting at $99K
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz SFU Loaded with Options Rohde & Schwarz SFU-B1-B2-B3-B4-B5-B6-B10-B11-B15-B30-B31-B90-K1-K4-K15-K20-K21-K22-K23-K30-K32-K35-K37-K40-K41-K42-K43-K55-K60-K80-K190-K191-K192-K193-K194-K199-K221-K222-K354-K356-K363 The R&S SFU is th
Used SMT Equipment | In-Circuit Testers
Rohde & Schwarz SFU Loaded with Options Rohde & Schwarz SFU-B1-B2-B3-B4-B5-B6-B10-B11-B15-B30-B31-B90-K1-K4-K15-K20-K21-K22-K23-K30-K32-K35-K37-K40-K41-K42-K43-K55-K60-K80-K190-K191-K192-K193-K194-K199-K221-K222-K354-K356-K363 The R&S SFU is th
