Full Site - : stress test (Page 8 of 54)

High-density multi-layer PCB with 3 Mils Minimum Line Width

High-density multi-layer PCB with 3 Mils Minimum Line Width

New Equipment | Assembly Services

1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Testing voltage: 50 to 300V Packing: vacuum packing for PCB, and good condition outer boxes

Shenzhen Linghangda Electronic Co.,Ltd

JDSU FST-2802-003-1GE-A03-A04

JDSU FST-2802-003-1GE-A03-A04

Used SMT Equipment | In-Circuit Testers

JDSU FST-2802-003-1GE-A03-A04 Acterna Ethernet and Fibre Channel Services Module The FST-2802 is a handheld Ethernet, Fibre Channel, and IP services test instrument designed to meet the needs of service providers for turning up and troubleshoot

Test Equipment Connection

Senior Design Engineer

Career Center | Murphy, North Carolina USA | Engineering

We are seeking a qualified and experienced senior design engineer to join our team. The best candidate will use both mechanical and electrical engineering skills to design innovative power supplies that are highly efficient, rugged, and have high rel

Aegis Power Systems, Inc.

Eight-layer PCB with Immersing Au Surface Treatment, Used for Medical Equipments

Eight-layer PCB with Immersing Au Surface Treatment, Used for Medical Equipments

New Equipment | Assembly Services

1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20s Test voltage: 50 to 300V Package: vacuum packing for PCB, and good condition outer box; attached strong strap to reinforce outer box

Shenzhen Linghangda Electronic Co.,Ltd

Inservco, Inc.

Industry Directory | Manufacturer

Electronic Manufacturing Services

Exfo CableSHARK P3

Exfo CableSHARK P3

Used SMT Equipment | In-Circuit Testers

Exfo CableSHARK P3 VF/DSL Cable Qualifier EXFO CableSHARK P3 - POTS / DSL Tester The CableSHARK P3 includes the necessary VF and broadband measurements for qualifying and troubleshooting a local loop such as loop holding/dialling, frequency r

Test Equipment Connection

Exfo CableShark P3

Exfo CableShark P3

Used SMT Equipment | In-Circuit Testers

Exfo CableSHARK P3 VF/DSL Cable Qualifier EXFO CableSHARK P3 - POTS / DSL Tester The CableSHARK P3 includes the necessary VF and broadband measurements for qualifying and troubleshooting a local loop such as loop holding/dialling, frequency r

Test Equipment Connection

MTCM for MOST150 Coax Physical Layer Testing

Industry News | 2016-04-20 09:33:40.0

RUETZ SYSTEM SOLUTIONS Introduces MOST Tester Cable Model as New Extension for Physical Layer Stress Test Tool

RUETZ SYSTEM SOLUTIONS GmbH

Technology Seminars, Inc.

Industry Directory | Consultant / Service Provider

Serving the Educational Needs of Modern Technologies

A Study on Effects of Copper Wrap Specifications on Printed Circuit Board Reliability

Technical Library | 2021-07-20 20:02:29.0

During the manufacturing of printed circuit boards (PCBs) for a Flight Project, it was found that a European manufacturer was building its boards to a European standard that had no requirement for copper wrap on the vias. The amount of copper wrap that was measured on coupons from the panel containing the boards of interest was less than the amount specified in IPC-6012 Rev B, Class 3. To help determine the reliability and usability of the boards, three sets of tests and a simulation were run. The test results, along with results of simulation and destructive physical analysis, are presented in this paper. The first experiment involved subjecting coupons from the panels supplied by the European manufacturer to thermal cycling. After 17 000 cycles, the test was stopped with no failures. A second set of accelerated tests involved comparing the thermal fatigue life of test samples made from FR4 and polyimide with varying amounts of copper wrap. Again, the testing did not reveal any failures. The third test involved using interconnect stress test coupons with through-hole vias and blind vias that were subjected to elevated temperatures to accelerate fatigue failures. While there were failures, as expected, the failures were at barrel cracks. In addition to the experiments, this paper also discusses the results of finite-element analysis using simulation software that was used to model plated-through holes under thermal stress using a steady-state analysis, also showing the main failure mode was barrel cracking. The tests show that although copper wrap was sought as a better alternative to butt joints between barrel plating and copper foil layers, manufacturability remains challenging and attempts to meet the requirements often result in features that reduce the reliability of the boards. Experimental and simulation work discussed in this paper indicate that the standard requirements for copper wrap are not contributing to the overall board reliability, although it should be added that a design with a butt joint is going to be a higher risk than a reduced copper wrap design. The study further shows that procurement requirements for wrap plating thickness from Class 3 to Class 2 would pose little risk to reliability (minimum 5 μm/0.197 mil for all via types).Experimental results corroborated by modeling indicate that the stress maxima are internal to the barrels rather than at the wrap location. In fact, the existence of Cu wrap was determined to have no appreciable effect on reliability.

NASA Office Of Safety And Mission Assurance


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