Industry Directory | Manufacturer
ANZER (formerly Western Reserve Controls) specializes in the electronic design and manufacturing of SMT & Thru-Hole products. From prototypes to high/low volume assemblies, including cable harnesses and complete box builds.
40mm Applications Solder Joint Quality (BGA, Leaded) Bridging Voiding Opens Bare boards (Inner layers, traces, vias) Component Package Inspection (wire bonds) Subtle Defect Inspection
New Equipment | Test Equipment
Agilent/HP DSO7012A Oscilloscope: 100 MHz, 2 analog channels Agilent s InfiniiVision DSO7012A, equipped with a 12.1” XGA display, comes in a quiet package that is just 6.5” deep, and weighs only 13 pounds. With the world s fastest uncompromised upd
Electronics Forum | Thu Sep 21 12:10:16 EDT 2000 | Boca
On the money as usual! (Your subtle approach is something to behold. Much like my approach, which has gotten me into more grief over the years than I should be allowed to have.) Boca
Electronics Forum | Mon Jun 18 11:06:31 EDT 2001 | Gil Zweig
In-line systems are effective in detecting the obvious defects such as solder bridges, missing balls and excessive solder voids. They may not be as effective in detecting the subtle changes in solder bond shapes (signatures) indicating loss or chang
Used SMT Equipment | In-Circuit Testers
Agilent DSO8064A The Infiniium 8000 Series oscilloscopes offer designers the industry's first oscilloscope family with responsive deep memory, superior signal viewing and advanced analysis. The four digital storage oscilloscopes (DSOs) and mixed
Used SMT Equipment | In-Circuit Testers
FLIR A320 High Resolution, Plug & Play Infrared Camera for Machine Vision The FLIR A320 Infrared Camera is an affordable and accurate solution for machine vision and automation systems that require non-contact imaging and temperature measurement
Industry News | 2016-06-27 14:59:09.0
GPD Global introduces the NEW TempView Thermal Imaging System that ensures the success of heated dispensing processes like Underfill, Encapsulations, Dam and Fill, and more. The TempView Thermal Imaging System monitors the temperature of the entire substrate for complete heat profile characterization. Regions of the product may be selected for monitoring during the heating process. Now you can accurately monitor temperature of specific devices to be sure they are up to temperature before starting a process.
Industry News | 2003-02-06 08:28:24.0
Will Premiere Its 2002 Roadmap at IPC SMEMA Council�s APEX Conference in Anaheim, CA, March 31-April 2
Technical Library | 2015-04-29 03:29:56.0
Statistical Appearance Modelling technology enables an AOI system to “learn real world variation” based on operator interaction with inspection task results. This provides an accurate statistical description of normal variation in a product. With modelling technology, the user does not have to anticipate potential defects as the system will “flag” anything outside the “normal production range”. And, since the system is programmed with real production variation, it is sensitive to small subtle changes enabling reliable defect detection. Autonomous prediction of process variation enables an AOI system to be set up from a single PCB with production-ready performance. Setup time can be
Technical Library | 2018-03-05 11:17:31.0
In order to comply with RoHS and WEEE directives, many circuit assemblers are transitioning some or all of their soldering processes from tin-lead to lead-free within the upcoming year. There are no drop-in replacement alloys for tin-lead solder, which is driving a fundamental technology change. This change is forcing manufacturers to take a closer look at everything associated with the assembly process: board and component materials, logistics and materials management, solder alloys and processing chemistries, and even soldering methods. Do not expect a dramatic change in soldering behavior when moving to lead-free solders. The melting points of the alloys are higher, but at molten temperatures the different alloys show similar behaviors in a number of respects. Expect subtler changes, especially near the edges of a process window that is assumed based on tin-lead experience rather than defined through lead-free experimentation. These small changes, many of them yet to be identified and understood, will manifest themselves with lower assembly yields. The key to keeping yields up during the transition to lead-free is quickly learning what and where the subtle distinctions are, and tuning the process to accommodate them.
Semi-automated, programmable X-ray inspection system with multi-axis for prototyping, failure analysis, manufacturing process validation and rework verification for PCBs up to 18 x 20". The XT-3 is a high quality high-resolution manual x-ray inspecti
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
| https://www.eptac.com/webinars/inspection-part-ii-pcb-assembly-inspection-getting-it-right
-610 "Acceptability of Electronic Assemblies", though it is key, but rather being able to alter your thought process to allow you to visually identify subtle deviations in the norm and then apply the criteria
GPD Global | https://www.gpd-global.com/co_website/thermalImaging-max2.php
. TempView Thermal Imaging System captures and displays subtle thermal patterns and small temperature differences (Image 1) with a high sensitivity detector
