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Nordson YESTECH FX-942 Automated Optical Inspection System Recognized for Excellence by Asian Electronics Industry

Industry News | 2018-05-06 18:17:44.0

Nordson YESTECH announces that it was recognized with two awards for its FX-942 Dual-sided Automated Optical Inspection (AOI) system. The awards were presented during Nepcon China, the prestigious global exhibition on SMT (surface mount technology) and EMA (electronics manufacturing automation) that brings together all major brands from the electronics manufacturing industry, held in Shanghai 24th – 26th April 2018.

Nordson YESTECH

Datest Wins Global Technology Award for Its SPEA 4060 with GOEPEL/JTAG Boundary Scan Technology

Industry News | 2011-11-20 12:21:31.0

Datest has been awarded a Global Technology Award in the category of Test Services for its SPEA 4060 Flying Probe Tester with GOEPEL Boundary Scan.

Datest

Datest Wins A 2012 NPI Award for Its SPEA 4060 with GOEPEL Boundary Scan Technology

Industry News | 2012-03-07 01:09:11.0

Datest has been awarded a 2012 NPI Award in the category of Test and Inspection - ICT for its SPEA 4060 Flying Probe Tester with GOEPEL Boundary Scan.

Datest

JTAG Technologies’ Preview for Autotestcon 2016 Booth # 826, Anaheim September 12-15,

Industry News | 2016-08-06 20:15:39.0

JTAG Technologies, a leader in innovative boundary‐scan (IEEE Standard 1149.1) products delivering a broad line of software and hardware tools for test preparation, test execution, test result analysis, and in‐systemprogramming applications, will demonstrate amongst other new boundary scan solutions :

JTAG Technologies Inc.

JTAG Technologies’ Preview for Autotestcon 2016 Booth # 826, Anaheim September 12-15,

Industry News | 2016-09-05 20:16:54.0

JTAG Technologies will demonstrate amongst other new boundary scan solutions:

JTAG Technologies B. V.

JTAG Technologies’ Preview for IEEE Autotestcon 2017, Booth 721, Schaumburg, Illinois, September 14th-17t

Industry News | 2017-09-10 18:40:03.0

JTAG Technologies test execution, test result analysis, and in‐systemprogramming applications, will demonstrate amongst other new boundary scan solutions for the demanding avionics clientele at Autotestcon this year:

JTAG Technologies B. V.

Re: reflow/cure/wave for double side assembly

Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam

| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run

Optimal Speed for Universal Chip Shooters

Electronics Forum | Wed Jun 11 16:30:33 EDT 2003 | T.Vick

You have received some great feedback so far. I would like to summarize and add a few points regarding maintenance. You should start (as recommended already) by verifying your component library data. Using the default values from the master library i

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