Events Calendar | Tue Aug 18 00:00:00 EDT 2020 - Tue Aug 18 00:00:00 EDT 2020 | ,
How to Minimize Humidity Interaction with PCBAs for Robustness
Parts & Supplies | Assembly Accessories
Detailed Product Description Brand: JUKI Part Name: Conveyor PCB Part Number: 40007373 40007374 Machine: FX1R,2050 Condition: Original Used Origin: Japan 40007374 JUKI Conveyor PCB For FX1R Surface Mounting Machine P/N 40007373 Original Part
Used SMT Equipment | Pick and Place/Feeders
Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser
Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,
BGA & Area Array Failures, Causes & Corrective Actions Online Webinar
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
Technical Library | 2019-10-21 09:58:50.0
An ACI Technologies customer inquired regarding printed circuit board(PCB) failures that were becoming increasingly prevalent after the SMT (surface mount technology) manufacturing process. The failures were detected by electrical testing, but were undetermined as to the location and specific devices causing the failures. The failures were suspected to be caused predominately in the BGA (ball grid array) devices located on specific sites on this 16 layer construction. Information that was provided on the nature of the failures (i.e., opens or shorts) included high resistance shorts that were occurring in those specified areas. The surface finish was a eutectic HASL (hot air solder leveling) and the solder paste used was a water soluble Sn/Pb(tin/lead).
ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
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ZK Electronic Technology Co., Limited professional in Surface-Mount Technology area and supports most major brands of electronic asembly equipments with a large selections of compatible SMT.
Technical Library | 2019-06-06 13:40:47.0
Legacy electronics assemblies, such as through-hole (Figure 1) and connectorized component packages, are robust and prevalent throughout industry. However, each of these assembly methods have reached their limits in terms of weight, volume, reliability, and most importantly cost. With cost reduction of assemblies now the primary focus area throughout the electronics industry, there is more of a need than ever to implement the latest advancements in surface mount technology (SMT) into electronics assembly designs. Although SMT has been utilized in the electronics industry for many years, implementation of the technology is still in the ever-evolving process of reducing component footprint size, component spacing, and component I/O pitch. Implementation of the most up-to-date SMT processes provides optimal weight, volume, and cost savings, for any type of assembly.
Technical Library | 2020-03-09 10:50:17.0
A customer called the Helpline seeking advice for cleaning no-clean fluxes prior to applying a conformal coating. The customer's assemblies were manufactured with a no-clean rosin based solder paste (ROL0) and were cleaned with an isopropyl alcohol (IPA) wash. After cleaning, a white residue was sometimes found in areas with high paste concentrations and was interfering with the adhesion of the conformal coating (Figure 1). For conformal coatings to adhere properly, the printed circuit board (PCB) surface must be clean of fluxes and other residues. In addition, ionic contamination left by flux residues can lead to corrosion and dendrite growth, two common causes of electronic opens and shorts. Other residues can lead to unwanted impedance and physical interference with moving parts.
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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