SMt BGA Rework and Repair Equipment including Split Vision processes and lead free soldered product rework application. Thru-Hole Desoldering and Plating Equipment.
Two-piece Drawn RF Shields Engineering Kit, EMI Shielded Cans, RF Shielding Cabinets for PCB, Board Level Shielding, Tin Plated Steel, SMD. Seamless Protective EMI/RFI Cages, available for purchasing online! Complimentary CAD files are available for
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New Equipment | Industrial Automation
Sandy.[mailto:unity@mvme.cn] Sandy.[WhatsApp/Skype/Mobile:+8618020776786] Sandy.[Quote to you within the shortest possible time with our best price] Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE
Electronics Forum | Mon Mar 03 23:24:06 EST 2008 | Mag10
I have a project to evaluate solderability of various metals or plated finish. I'd like to tap in to get some advise. The project is to evaluate solderability of various metals or plated finishes for RF shield application with reflow. Due to the hig
Industry News | 2016-07-10 13:54:05.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), and Parker Chomerics, a Division of Parker Hannifin Corporation (NYSE:PH), are partnering at SEMICON West in Parker Chomerics' booth #6557 to demonstrate precision, high-volume spray applications for EMI coating solutions. One specific solution uses Nordson ASYMTEK's Select Coat® Conformal Coating System with a DispenseJet® applicator to apply thin coatings of Parker Chomerics' new CHO-SHIELD-604 conductive coating to achieve a target thickness of 25 µm. SEMICON West is being held at Moscone Center, San Francisco, CA, July 12-14, 2016.
Industry News | 2021-12-14 15:19:37.0
High-Efficiency Power Inductors from New Yorker Electronics are Magnetically Shielded for Low Core Loss
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Parts & Supplies | Pick and Place/Feeders
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Parts & Supplies | Pick and Place/Feeders
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Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
Technical Library | 2023-07-25 16:25:56.0
This paper address two significant applications of stencils in advance packaging field: 1. Ultra-Thin stencils for miniature component (0201m) assembly; 2. Deep Cavity stencils for embedded (open cavity) packaging. As the world of electronics continues to evolve with focus on smaller, lighter, faster, and feature-enhanced high- performing electronic products, so are the requirement for complex stencils to assemble such components. These stencil thicknesses start from less than 25um with apertures as small as 60um (or less). Step stencils are used when varying stencil thicknesses are required to print into cavities or on elevated surfaces or to provide relief for certain features on a board. In the early days of SMT assembly, step stencils were used to reduce the stencil thickness for 25 mil pitch leaded device apertures. Thick metal stencils that have both relief-etch pockets and reservoir step pockets are very useful for paste reservoir printing. Electroform Step-Up Stencils for ceramic BGA's and RF Shields are a good solution to achieve additional solder paste height on the pads of these components as well as providing exceptional paste transfer for smaller components like uBGAs and 0201s. As the components are getting smaller, for example 0201m, or as the available real estate for component placement on a board is getting smaller – finer is the aperture size and the pitch on the stencils. Aggressive distances from step wall to aperture are also required. Ultra-thin stencils with thicknesses in the order of 15um-40um with steps of 15um are used to obtain desired print volumes. Stencils with thickness to this order can be potential tools even to print for RDLs in the package.
SMTnet Express, February 27, 2020, Subscribers: 34,359, Companies: 10,970, Users: 25,651 Dispensing EMI Shielding Materials: An Alternative to Sputtering Credits: Nordson ASYMTEK Shielding electronic systems against electromagnetic interference
ORION Industries | http://orionindustries.com/pdfs/frfilm.pdf
. Low moisture absorption and high chemical resistance make it suitable for laminated EMI/RFI shields. For a display screen shield, VALOX FR1 film provides high p e rf o rmance in a t h i n gauge
KD Electronics Ltd. | http://www.kundasmt.com/?A-Equipment-Accessories/6008.html
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