New SMT Equipment: switch failure due to flux (3)

ETA S-Series High-End Reflow Ovens

ETA S-Series High-End Reflow Ovens

New Equipment | Reflow

S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

I.C.T ( Dongguan ICT Technology Co., Ltd. )

ETA E-Series Lead-Free Reflow Ovens

ETA E-Series Lead-Free Reflow Ovens

New Equipment | Reflow

E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Electronics Forum: switch failure due to flux (4)

How to reduce solder joint voids of LED without using vacuum reflow?

Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson

Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part

White Residue / Vapor Degrease

Electronics Forum | Thu Jan 14 22:59:08 EST 1999 | Chris G.

I get white residue on my PCBs after vapor degreasing. No comments on the vapor degreaser. Yes, I still use one of these. I use a vapor degreaser and a 1,1,1 replacement solvent due to the quick clean and quick dry times. Anyway, I only get white

Industry News: switch failure due to flux (24)

Debbie Carboni, KYZEN Corporation, to Present at SMTA Capital Chapter Meeting on June 10th

Industry News | 2021-05-25 12:56:56.0

The SMTA Officer team is excited to provide our members with a free technical webinar on "The Relationship Between Cleanliness and Reliability/Durability" by Debbie Carboni, Global Product Manager at KYZEN Corporation. The presentation will take place on June 10th at 11:00am EST and include:

Surface Mount Technology Association (SMTA)

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:14:11.0

How to Prevent the Tombstone and Open Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Videos: switch failure due to flux (3)

Lead Free Reflow Oven

Lead Free Reflow Oven

Videos

E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

Dongguan Intercontinental Technology Co., Ltd.

SMD Reflow Oven

SMD Reflow Oven

Videos

S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con

Dongguan Intercontinental Technology Co., Ltd.

Express Newsletter: switch failure due to flux (631)

Partner Websites: switch failure due to flux (98)

5 Common Solder Mistakes and How to Resolve Them

| https://www.eptac.com/blog/5-common-solder-mistakes-and-how-to-resolve-them

. Solder-Starved Joint A   solder-starved joint   is just that: a joint that does not have enough solder. Despite making the necessary electrical contact, the insufficient solder weakens the joint and increases susceptibility to cracking and failure


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