Industry News | 2021-05-21 12:12:03.0
Device Reduces Component Temperature by Over 25%, Enabling Higher Power Handling Capability or Longer Useful Life
New Equipment | Test Equipment
The HP Agilent 8720D Network Analyzer features a frequency range of 50 MHz to 20 GHz, a drastically faster processor compared to earlier versions, a built-in fast sweeping synthesized source, an integrated solid-state switching S-Parameter Test Set,
Technical Library | 2020-09-08 16:43:32.0
Atomic layer deposition (ALD) is an ultra-thin film deposition technique that has found many applications owing to its distinct abilities. They include uniform deposition of conformal films with controllable thickness, even on complex three-dimensional surfaces, and can improve the efficiency of electronic devices. This technology has attracted significant interest both for fundamental understanding how the new functional materials can be synthesized by ALD and for numerous practical applications, particularly in advanced nanopatterning for microelectronics, energy storage systems, desalinations, catalysis and medical fields. This review introduces the progress made in ALD, both for computational and experimental methodologies, and provides an outlook of this emerging technology in comparison with other film deposition methods. It discusses experimental approaches and factors that affect the deposition and presents simulation methods, such as molecular dynamics and computational fluid dynamics, which help determine and predict effective ways to optimize ALD processes, hence enabling the reduction in cost, energy waste and adverse environmental impacts. Specific examples are chosen to illustrate the progress in ALD processes and applications that showed a considerable impact on other technologies.
Technical Library | 2022-10-31 17:25:37.0
Mixed formulation solder alloys refer to specific combinations of Sn-37Pb and SAC305 (96.5Sn–3.0Ag–0.5Cu). They present a solution for the interim period before Pb-free electronic assemblies are universally accepted. In this work, the surfaces of mixed formulation solder alloys have been studied by in situ and real-time Auger electron spectroscopy as a function of temperature as the alloys are raised above the melting point. With increasing temperature, there is a growing fraction of low-level, bulk contaminants that segregate to the alloy surfaces. In particular, the amount of surface C is nearly _50–60 at. % C at the melting point. The segregating impurities inhibit solderability by providing a blocking layer to reaction between the alloy and substrate. A similar phenomenon has been observed over a wide range of (SAC and non-SAC) alloys synthesized by a variety of techniques. That solder alloy surfaces at melting have a radically different composition from the bulk uncovers a key variable that helps to explain the wide variability in contact angles reported in previous studies of wetting and adhesion. VC 2011 American Vacuum Society. [DOI: 10.1116/1.3584821]
New Equipment | Test Equipment
Aeroflex IFR 2399B A spectrum analyzer with outstanding performance and a user friendly visual interface simplifying many complex measurements. 9 kHz to 3.0 GHz fully synthesized frequency range Lightweight, portable and rugged construct
New Equipment | Test Equipment
Agilent/HP 8713C-101-100 Economy Network Analyzer, 300 kHz to 3 GHz. Key Features and Specifications Integrated transmission/reflection test set with narrowband and broadband detection "Real time" sweep speed (50 ms/sweep), synthesized
New Equipment | Test Equipment
The SR760 and is a single-channel, 100 kHz FFT spectrum analyser with a dynamic range of 90 dB and a real-time bandwidth of 100 kHz. The speed and dynamic range of these instruments, coupled with their flexibility and many analysis modes, makes them
New Equipment | Test Equipment
The Agilent 85107B microwave vector network analyzer is a complete system configured with an Agilent 8510C vector network analyzer, a 50 GHz S-parameter test set, a 50 GHz synthesized sweeper, and 2.4 mm measurement accessories. Option 005 adds step
Career Center | Addison,Texas, Texas USA | Engineering
RF TEST ENGINEER The selected candidate will develop test sets for testing printed circuit boards used in vhf transmitters and receivers. The ability to develop test software and hardware for automated control of test equipment, fault isolation and
Used SMT Equipment | General Purpose Test & Measurement
The HP 3784A is a portable error performance/jitter test set, offering standard telecom interfaces at 704 kb/s, 2, 8, and 34 Mb/s. In addition it has binary TTL/ECL interfaces for measurements up to 50 Mb/s using internal clock synthesizer.5 The HP 3
