Industry Directory | Manufacturer
Shenzhen Honreal Technology Co., focus on global Surface Mount electronic assembly field for 15 years. Specializing in providing various brands of SMT pick and place machines and spare parts. Fuji, Panasonic, Juki, Hitachi, Yahama
Industry Directory | Consultant / Service Provider
DownStream is a software company focused on helping engineering organizations automate the PCB Release Process. We offer tools that help optimize, validate and document PCB designs before they are released to manufacturing.
ProntoPLACE used by electronics manufacturers will quickly program your surface mount SMT and thru-hole assembly equipment. In minutes Unisoft ProntoPLACE software translates CAD or Gerber and Bill of Materials (BOM) files into real reference desig
ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
Electronics Forum | Thu Mar 28 09:43:19 EDT 2019 | dekhead
Pneumatic power down error does go back to MMX12. MM's info is communicated to NM (in PC enclosure) via 100 way cable. Depending on software version, the "Pneumatic Power Down" error may be the default (initial) error generated with bad connection /
Electronics Forum | Thu Jul 30 16:27:40 EDT 2020 | michelcf
Good Day Sir. Where is the MMX?
Used SMT Equipment | AOI / Automated Optical Inspection
Make: Mirtec Model: MV-3L Vintage: 2017 Description: Desktop AOI Details: Operating System: Windows 7 Software Version: 5.5.4.00 Cameras: 5 (1 top down and 4 side) Camera Resolution: All 10MP [Mega Pixel) Other: Inteli-Beam Laser inspection
Used SMT Equipment | AOI / Automated Optical Inspection
This machine is available for immediate purchase. Our end-user customer does not have a set price for this item. They have told us to forward them all offers. Please contact ashlin@bajabid.com for more information. Features: YesVis
Industry News | 2016-06-22 15:33:28.0
Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.
Industry News | 2016-08-25 17:56:34.0
GPD Global's advanced Precision Auger Pump retrofits into your dispensing system to provide excellent dispense control and repeatability. Precision Auger Pump Integration provides your process development with a broad range of functionality.
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Parts & Supplies | Screen Printers
Name: P8466 MPM printing system hard, WIN NT version of the software Part Number: P8466 Description: For UP2000HIE; NT operating system of the machine Applicable models: UP2000HIE P8466 MPM printing system hard, WIN NT version of the softwa
Parts & Supplies | SMT Equipment
MPM printing system hard(P8466) Name: P8466 MPM printing system hard, WIN NT version of the software Part Number: P8466 Description: For UP2000HIE; NT operating system of the machine Applicable models: UP2000HIE P8466 MPM printing system
Technical Library | 2023-01-17 17:50:59.0
Heller's new Condenser Tube Flux Recovery System is designed to provide more efficient flux collection than earlier Heller flux collection systems; while providing minimal down time for inspection and cleaning. The entire system easily fits within the rear of the top shell of an 1800-EXL oven. The system utilizes a different set of top shell caps specially designed to provide the best serviceability of both the flux collection system and maintenance of the heater zone blower motors.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
http://www.gpd-global.com Tilt-and-Rotate configuration is available. Full featured programming makes conformal coating processes quick and easy. 3-axis Conformal Coating System for printed circuit boards that provides a reliable robotic platform f
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
Training Courses | | | Other Courses
Other courses related to electronics manufacturing and assembly
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Wine Down Wednesday: Enabling a Global Resilient Supply Chain with Technology Leadership
Events Calendar | Tue Apr 21 00:00:00 EDT 2020 - Thu Apr 23 00:00:00 EDT 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | Seven Hills, Ohio USA | Engineering,Production
The qualified candidate will be responsible for the operation and progamming of pick and place machines. This will include operating screen printing equipment set-up of reflow and cleaning systems and tear down of said systems. Hand soldering of in
Career Center | Noida, India | Maintenance,Management,Production
Over 12 years of experience in Assembly Line Production, PCB, SMT, Process Improvements, testing & troubleshooting, time and motion study, Value– Engineering as well as Quality in varied industries.
Air Powered Dispensing If you don't see the images, please visit online version at #Application.SmtNet.baseURL#/express/ Featured Article Air Powered Dispensing EFD Inc. Liz Mitchell Air-powered dispensing systems use controlled pulses
GPD Global | https://www.gpd-global.com/dispenser-system-max.php
. Uninterrupted Power Supply (UPS) If a power outage occurs, the UPS (uninterrupted power supply) detects a loss of utility power and outputs a signal to the dispense system to initiate a safe power down
Heller Industries Inc. | https://hellerindustries.com/power-electronics/
Power Electronics -Power Device Packaging Home » Power Device Packaging Power Electronics: Device Packaging The Need for Void-Free Power Electronics Device Packaging The trend today in power electronics is to move towards smaller form factors while maintaining or increasing overall power requirements
